Pooya Tadayon

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hyperchip
- Patent number 12,355,002
- Issue date Jul 8, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die last and waveguide last architecture for silicon photonic packa...
- Patent number 12,345,932
- Issue date Jul 1, 2025
- Intel Corporation
- Bai Nie
- G02 - OPTICS
Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 12,349,303
- Issue date Jul 1, 2025
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 12,341,080
- Issue date Jun 24, 2025
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate optical vias
- Patent number 12,313,890
- Issue date May 27, 2025
- Intel Corporation
- Pooya Tadayon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, method and system for optical communication with a photonic...
- Patent number 12,298,572
- Issue date May 13, 2025
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Grant
Coreless electronic substrates having embedded inductors
- Patent number 12,272,484
- Issue date Apr 8, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self cooling adaptive flow branching heat exchanger system for cool...
- Patent number 12,213,288
- Issue date Jan 28, 2025
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, method and system for optical communication with a waveguid...
- Patent number 12,164,147
- Issue date Dec 10, 2024
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Grant
Hybrid thermal interface material (TIM) with reduced 3D thermal res...
- Patent number 12,087,658
- Issue date Sep 10, 2024
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 12,074,138
- Issue date Aug 27, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum modulated two phase cooling loop efficiency and parallelism...
- Patent number 12,057,370
- Issue date Aug 6, 2024
- Intel Corporation
- Paul Diglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chevron interconnect for very fine pitch probing
- Patent number 12,032,002
- Issue date Jul 9, 2024
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 11,984,430
- Issue date May 14, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum modulated two phase cooling loop performance enhancement
- Patent number 11,976,671
- Issue date May 7, 2024
- Intel Corporation
- Paul Diglio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,978,689
- Issue date May 7, 2024
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to develop lithographically defined high aspec...
- Patent number 11,822,249
- Issue date Nov 21, 2023
- Intel Corporation
- Pooya Tadayon
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Hyperchip
- Patent number 11,824,041
- Issue date Nov 21, 2023
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 11,817,423
- Issue date Nov 14, 2023
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-member test probe structure
- Patent number 11,774,489
- Issue date Oct 3, 2023
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,756,860
- Issue date Sep 12, 2023
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massively-parallel micronozzle array for direct write electrodeposi...
- Patent number 11,639,556
- Issue date May 2, 2023
- Intel Corporation
- Joe Walczyk
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,626,395
- Issue date Apr 11, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 11,622,466
- Issue date Apr 4, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatuses for microelectronic assemblies
- Patent number 11,581,237
- Issue date Feb 14, 2023
- Intel Corporation
- Joe F. Walczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-beam test probe
- Patent number 11,543,454
- Issue date Jan 3, 2023
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Liquid cooling through conductive interconnect
- Patent number 11,515,232
- Issue date Nov 29, 2022
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL ALIGNMENT FEATURES FOR GLASS WAVEGUIDE TO PHOTONIC INTEG...
- Publication number 20250216629
- Publication date Jul 3, 2025
- Intel Corporation
- Nicholas D. Psaila
- G02 - OPTICS
Information Patent Application
MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...
- Publication number 20250098179
- Publication date Mar 20, 2025
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SOCKET INTERCONNECTS WITH LIQUID PASSIVATION LAYER AND...
- Publication number 20250079278
- Publication date Mar 6, 2025
- Intel Corporation
- Karumbu Nathan Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240332100
- Publication date Oct 3, 2024
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...
- Publication number 20240244800
- Publication date Jul 18, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYPERCHIP
- Publication number 20240243099
- Publication date Jul 18, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20240234245
- Publication date Jul 11, 2024
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR
- Publication number 20240094476
- Publication date Mar 21, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY F...
- Publication number 20240087971
- Publication date Mar 14, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS
- Publication number 20240063134
- Publication date Feb 22, 2024
- Intel Corporation
- Xiaoning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERCHIP
- Publication number 20240038722
- Publication date Feb 1, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCON...
- Publication number 20240038729
- Publication date Feb 1, 2024
- Intel Corporation
- Pooya TADAYON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES
- Publication number 20240027699
- Publication date Jan 25, 2024
- Intel Corporation
- Nicholas D. Psaila
- G02 - OPTICS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING
- Publication number 20240027706
- Publication date Jan 25, 2024
- Intel Corporation
- Pooya Tadayon
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES
- Publication number 20240027697
- Publication date Jan 25, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT DEVICE INCLUDING METALENS STRUCTURE AN...
- Publication number 20240027698
- Publication date Jan 25, 2024
- Nicholas D. Psaila
- G02 - OPTICS
Information Patent Application
DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...
- Publication number 20230260870
- Publication date Aug 17, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
HYPERCHIP
- Publication number 20230238357
- Publication date Jul 27, 2023
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CHIP-TO-CHIP OPTICAL DATA TRANSFER BACKGROUND
- Publication number 20230204819
- Publication date Jun 29, 2023
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...
- Publication number 20230204877
- Publication date Jun 29, 2023
- Intel Corporation
- John M. Heck
- G02 - OPTICS
Information Patent Application
OPTICAL PACKAGING USING EMBEDDED-IN-MOLD (EIM) OPTICAL MODULE INTEG...
- Publication number 20230204879
- Publication date Jun 29, 2023
- Intel Corporation
- Dowon Kim
- G02 - OPTICS
Information Patent Application
LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
- Publication number 20230209759
- Publication date Jun 29, 2023
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE
- Publication number 20230197621
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
- Publication number 20230197594
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...
- Publication number 20230185037
- Publication date Jun 15, 2023
- Intel Corporation
- Eric J. M. Moret
- G02 - OPTICS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187850
- Publication date Jun 15, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187337
- Publication date Jun 15, 2023
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20230140685
- Publication date May 4, 2023
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS

Pooya Tadayon

Person

Patents Grantslast 30 patents

Hyperchip

Die last and waveguide last architecture for silicon photonic packa...

Low force liquid metal interconnect solutions

Semiconductor device stack-up with bulk substrate material to mitig...

Through-substrate optical vias

Device, method and system for optical communication with a photonic...

Coreless electronic substrates having embedded inductors

Double-sided substrate with cavities for direct die-to-die intercon...

Self cooling adaptive flow branching heat exchanger system for cool...

Device, method and system for optical communication with a waveguid...

Hybrid thermal interface material (TIM) with reduced 3D thermal res...

Hyperchip

Vacuum modulated two phase cooling loop efficiency and parallelism...

Chevron interconnect for very fine pitch probing

Thermally enhanced silicon back end layers for improved thermal per...

Hyperchip

Vacuum modulated two phase cooling loop performance enhancement

Semiconductor device stack-up with bulk substrate material to mitig...

Method and apparatus to develop lithographically defined high aspec...

Hyperchip

Double-sided substrate with cavities for direct die-to-die intercon...

Multi-member test probe structure

Semiconductor device stack-up with bulk substrate material to mitig...

Massively-parallel micronozzle array for direct write electrodeposi...

Thermal spreading management of 3D stacked integrated circuits

Low force liquid metal interconnect solutions

Cooling apparatuses for microelectronic assemblies

Double-beam test probe

Liquid cooling through conductive interconnect

Sloped metal features for cooling hotspots in stacked-die packages

Patents Applicationslast 30 patents

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

MECHANICAL ALIGNMENT FEATURES FOR GLASS WAVEGUIDE TO PHOTONIC INTEG...

MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...

LIQUID METAL SOCKET INTERCONNECTS WITH LIQUID PASSIVATION LAYER AND...

GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES

HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...

HYPERCHIP

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR

COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY F...

INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS

HYPERCHIP

DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCON...

TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES

PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING

PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES

PHOTONICS INTEGRATED CIRCUIT DEVICE INCLUDING METALENS STRUCTURE AN...

DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...

HYPERCHIP

TECHNOLOGIES FOR CHIP-TO-CHIP OPTICAL DATA TRANSFER BACKGROUND

TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...

OPTICAL PACKAGING USING EMBEDDED-IN-MOLD (EIM) OPTICAL MODULE INTEG...

LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS

LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...

REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...

LIQUID METAL CONNECTION DEVICE AND METHOD

FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...