Prabhakara Gopaladasu

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for selectively etching with reduced aspect ratio dependence
- Patent number 10,541,141
- Issue date Jan 21, 2020
- Lam Research Corporation
- Adarsh Basavalingappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous low-k dielectric etch
- Patent number 10,361,091
- Issue date Jul 23, 2019
- Lam Research Corporation
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively etching with reduced aspect ratio dependence
- Patent number 10,037,890
- Issue date Jul 31, 2018
- Lam Research Corporation
- Adarsh Basavalingappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively etching silicon oxide with respect to an org...
- Patent number 10,002,773
- Issue date Jun 19, 2018
- Lam Research Corporation
- Bhaskar Nagabhirava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ photoresist strip during plasma etching of active hard mask
- Patent number 8,912,633
- Issue date Dec 16, 2014
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
In-situ photoresist strip during plasma etching of active hard mask
- Patent number 8,283,255
- Issue date Oct 9, 2012
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PA...
- Publication number 20230268192
- Publication date Aug 24, 2023
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS LOW-K DIELECTRIC ETCH
- Publication number 20180350618
- Publication date Dec 6, 2018
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE
- Publication number 20180330959
- Publication date Nov 15, 2018
- LAM RESEARCH CORPORATION
- Adarsh BASAVALINGAPPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVELY ETCHING SILICON OXIDE WITH RESPECT TO AN ORG...
- Publication number 20180102257
- Publication date Apr 12, 2018
- LAM RESEARCH CORPORATION
- Bhaskar NAGABHIRAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE
- Publication number 20180102253
- Publication date Apr 12, 2018
- LAM RESEARCH CORPORATION
- Adarsh BASAVALINGAPPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU PHOTORESIST STRIP DURING PLASMA ETCHING OF ACTIVE HARD MASK
- Publication number 20130001754
- Publication date Jan 3, 2013
- LAM RESEARCH CORPORATION
- Sangjun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ photoresist strip during plasma etching of active hard mask
- Publication number 20080293249
- Publication date Nov 27, 2008
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PROCESSING INCLUDING ETCHED LAYER PASSIVATION USING S...
- Publication number 20080064214
- Publication date Mar 13, 2008
- LAM RESEARCH CORPORATION
- Taejoon Han
- H01 - BASIC ELECTRIC ELEMENTS

Prabhakara Gopaladasu

Person

Patents Grantslast 30 patents

Method for selectively etching with reduced aspect ratio dependence

Porous low-k dielectric etch

Method for selectively etching with reduced aspect ratio dependence

Method for selectively etching silicon oxide with respect to an org...

In-situ photoresist strip during plasma etching of active hard mask

In-situ photoresist strip during plasma etching of active hard mask

Patents Applicationslast 30 patents

IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PA...

POROUS LOW-K DIELECTRIC ETCH

METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE

METHOD FOR SELECTIVELY ETCHING SILICON OXIDE WITH RESPECT TO AN ORG...

METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE

IN-SITU PHOTORESIST STRIP DURING PLASMA ETCHING OF ACTIVE HARD MASK

In-situ photoresist strip during plasma etching of active hard mask

SEMICONDUCTOR PROCESSING INCLUDING ETCHED LAYER PASSIVATION USING S...