Prachit Punyapor

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Amphur Thanyaburi, TH

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Patents Applicationslast 30 patents

Information Patent Application
Down Bond in Semiconductor Devices
- Publication number 20190221502
- Publication date Jul 18, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Joseph Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Leads Package With Improved Contact Pins
- Publication number 20170294367
- Publication date Oct 12, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Leads Package With Improved Contact Pins
- Publication number 20170005030
- Publication date Jan 5, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEADS PACKAGE WITH IMPROVED CONTACT PINS
- Publication number 20160148876
- Publication date May 26, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE WITH IMPROVED CONTACT PINS
- Publication number 20160148877
- Publication date May 26, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS