Pradeep Subrahmanyan

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming bottom dielectric isolation layers
- Patent number 12,170,230
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- SanKuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
V-NAND stacks with dipole regions
- Patent number 11,997,849
- Issue date May 28, 2024
- Applied Materials, Inc.
- Yong Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Construction of three-dimensional profiles of high aspect ratio str...
- Patent number 11,092,433
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Construction of three-dimensional profiles of high aspect ratio str...
- Patent number 10,670,393
- Issue date Jun 2, 2020
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- G01 - MEASURING TESTING
Information Patent Grant
Overlay control with non-zero offset prediction
- Patent number 10,409,171
- Issue date Sep 10, 2019
- KLA-Tencor Corporation
- Michael E. Adel
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Apparatus and method for chucking warped wafers
- Patent number 10,381,256
- Issue date Aug 13, 2019
- KLA-Tencor Corporation
- Pradeep Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process-sensitive metrology systems and methods
- Patent number 10,216,096
- Issue date Feb 26, 2019
- KLA-Tencor Corporation
- Myungjun Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Systems and methods for focus-sensitive metrology targets
- Patent number 10,209,627
- Issue date Feb 19, 2019
- KLA-Tencor Corporation
- Myungjun Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Arrangement of reticle positioning device for actinic inspection of...
- Patent number 8,779,635
- Issue date Jul 15, 2014
- KLA-Tencor Corporation
- Pradeep Subrahmanyan
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for synchronizing sample stage motion with a t...
- Patent number 8,772,731
- Issue date Jul 8, 2014
- KLA-Tencor Corporation
- Pradeep Subrahmanyan
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CONTACT INTEGRATION IN COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET)...
- Publication number 20240395879
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- San-Kuei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR COMPLEMENTARY FIELD...
- Publication number 20240387286
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- San-Kuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORDLINE CONTACT FORMATION FOR NAND DEVICE
- Publication number 20240365545
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Hsiang Yu Lee
Information Patent Application
WORDLINE CONTACT FORMATION FOR NAND DEVICE
- Publication number 20240363150
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Hsiang Yu Lee
- G11 - INFORMATION STORAGE
Information Patent Application
STRESS MANAGEMENT FOR PRECISE SUBSTRATE -TO- SUBSTRATE BONDING
- Publication number 20240266186
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- San-Kuei Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFOR...
- Publication number 20240266231
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Wonjae Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INFLUENCE FUNCTION-BASED MITIGATION OF SUBSTRATE DEFORMATION WITH F...
- Publication number 20240266233
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Wonjae Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MITIGATION OF SADDLE DEFORMATION OF SUBSTRATES USING FILM DEPOSITIO...
- Publication number 20240266174
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Wonjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
V-NAND STACKS WITH DIPOLE REGIONS
- Publication number 20240268108
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Yong Yang
- G11 - INFORMATION STORAGE
Information Patent Application
OPTIMIZED FILM DEPOSITION AND ION IMPLANTATION FOR MITIGATION OF ST...
- Publication number 20240266230
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Wonjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORDLINE CONTACT FORMATION FOR NAND DEVICE
- Publication number 20240185893
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- HsiangYu LEE
- G11 - INFORMATION STORAGE
Information Patent Application
3D MEMORY INCLUDING HOLLOW EPITAXIAL CHANNELS
- Publication number 20240188300
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- HsiangYu LEE
Information Patent Application
WORDLINE CONTACT FORMATION FOR NAND DEVICE
- Publication number 20240186178
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- HsiangYu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTION OF GLOBAL CURVATURE DURING STRESS MANAGEMENT
- Publication number 20240105641
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Pradeep K. SUBRAHMANYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Frequency and Amplitude Modulation of Implant Dose for Stress Manag...
- Publication number 20240103385
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Pradeep K. SUBRAHMANYAN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MEMORY DEVICES HAVING IMPROVED MEMORY STATE RETENTION
- Publication number 20240081063
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Milan PESIC
Information Patent Application
DRY ETCH FOR NITRIDE EXHUME PROCESSES IN 3D NAND FABRICATION
- Publication number 20240055269
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Sankuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORDLINE SIDEWALL CONTACTS IN 3D NAND STRUCTURES
- Publication number 20240046966
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Hsiang Yu Lee
- G11 - INFORMATION STORAGE
Information Patent Application
EPITAXIAL SILICON CHANNEL GROWTH
- Publication number 20230413569
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Hsiang Yu Lee
- C30 - CRYSTAL GROWTH
Information Patent Application
EPITAXIAL SILICON CHANNEL GROWTH
- Publication number 20230380170
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Hsiang Yu Lee
- C30 - CRYSTAL GROWTH
Information Patent Application
DOSE MAPPING USING SUBSTRATE CURVATURE TO COMPENSATE FOR OUT-OF-PLA...
- Publication number 20230367941
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOSE MAPPING AND SUBSTRATE ROTATION FOR SUBSTRATE CURVATURE CONTROL...
- Publication number 20230369014
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BOTTOM DIELECTRIC ISOLATION LAYERS
- Publication number 20230037719
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- SanKuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
V-NAND STACKS WITH DIPOLE REGIONS
- Publication number 20220384469
- Publication date Dec 1, 2022
- Applied Materials, Inc.
- Yong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION TO REDUCE CONTACT RESISTANCE IN SEMICONDUCTOR D...
- Publication number 20220359208
- Publication date Nov 10, 2022
- Sankuei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS AND OVERLAY MANAGEMENT FOR SEMICONDUCTOR PROCESSING
- Publication number 20220344282
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Pradeep K. Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER
- Publication number 20220344171
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRUCTION OF THREE-DIMENSIONAL PROFILES OF HIGH ASPECT RATIO STR...
- Publication number 20200271442
- Publication date Aug 27, 2020
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONSTRUCTION OF THREE-DIMENSIONAL PROFILES OF HIGH ASPECT RATIO STR...
- Publication number 20200173772
- Publication date Jun 4, 2020
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Overlay Control with Non-Zero Offset Prediction
- Publication number 20180253017
- Publication date Sep 6, 2018
- KLA-Tencor Corporation
- Michael E. Adel
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Pradeep Subrahmanyan

Person

Patents Grantslast 30 patents

Methods of forming bottom dielectric isolation layers

V-NAND stacks with dipole regions

Construction of three-dimensional profiles of high aspect ratio str...

Construction of three-dimensional profiles of high aspect ratio str...

Overlay control with non-zero offset prediction

Apparatus and method for chucking warped wafers

Process-sensitive metrology systems and methods

Systems and methods for focus-sensitive metrology targets

Arrangement of reticle positioning device for actinic inspection of...

Apparatus and method for synchronizing sample stage motion with a t...

Patents Applicationslast 30 patents

CONTACT INTEGRATION IN COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET)...

MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR COMPLEMENTARY FIELD...

WORDLINE CONTACT FORMATION FOR NAND DEVICE

WORDLINE CONTACT FORMATION FOR NAND DEVICE

STRESS MANAGEMENT FOR PRECISE SUBSTRATE -TO- SUBSTRATE BONDING

CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFOR...

INFLUENCE FUNCTION-BASED MITIGATION OF SUBSTRATE DEFORMATION WITH F...

MITIGATION OF SADDLE DEFORMATION OF SUBSTRATES USING FILM DEPOSITIO...

V-NAND STACKS WITH DIPOLE REGIONS

OPTIMIZED FILM DEPOSITION AND ION IMPLANTATION FOR MITIGATION OF ST...

WORDLINE CONTACT FORMATION FOR NAND DEVICE

3D MEMORY INCLUDING HOLLOW EPITAXIAL CHANNELS

WORDLINE CONTACT FORMATION FOR NAND DEVICE

CORRECTION OF GLOBAL CURVATURE DURING STRESS MANAGEMENT

Frequency and Amplitude Modulation of Implant Dose for Stress Manag...

MEMORY DEVICES HAVING IMPROVED MEMORY STATE RETENTION

DRY ETCH FOR NITRIDE EXHUME PROCESSES IN 3D NAND FABRICATION

WORDLINE SIDEWALL CONTACTS IN 3D NAND STRUCTURES

EPITAXIAL SILICON CHANNEL GROWTH

EPITAXIAL SILICON CHANNEL GROWTH

DOSE MAPPING USING SUBSTRATE CURVATURE TO COMPENSATE FOR OUT-OF-PLA...

DOSE MAPPING AND SUBSTRATE ROTATION FOR SUBSTRATE CURVATURE CONTROL...

METHODS OF FORMING BOTTOM DIELECTRIC ISOLATION LAYERS

V-NAND STACKS WITH DIPOLE REGIONS

PROCESS INTEGRATION TO REDUCE CONTACT RESISTANCE IN SEMICONDUCTOR D...

STRESS AND OVERLAY MANAGEMENT FOR SEMICONDUCTOR PROCESSING

LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER

CONSTRUCTION OF THREE-DIMENSIONAL PROFILES OF HIGH ASPECT RATIO STR...

CONSTRUCTION OF THREE-DIMENSIONAL PROFILES OF HIGH ASPECT RATIO STR...

Overlay Control with Non-Zero Offset Prediction