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Prasanna Raghavan
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die back side structures for warpage control
Patent number
11,322,456
Issue date
May 3, 2022
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coreless package architecture for multi-chip opto-electronics
Patent number
10,845,552
Issue date
Nov 24, 2020
Intel Corporation
Shawna M. Liff
G02 - OPTICS
Information
Patent Grant
Methods of forming trenches in packages structures and structures f...
Patent number
10,231,338
Issue date
Mar 12, 2019
Intel Corporation
Naga Sivakumar Yagnamurthy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly that includes stacked electronic devices
Patent number
9,633,937
Issue date
Apr 25, 2017
Intel Corporation
Huiyang Fei
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...
Publication number
20230307379
Publication date
Sep 28, 2023
Intel Corporation
Phil GENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL
Publication number
20200066655
Publication date
Feb 27, 2020
Intel Corporation
Feras EID
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CORELESS PACKAGE ARCHITECTURE FOR MULTI-CHIP OPTO-ELECTRONICS
Publication number
20190317285
Publication date
Oct 17, 2019
Intel Corporation
Shawna M. LIFF
G02 - OPTICS
Information
Patent Application
METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES F...
Publication number
20160381800
Publication date
Dec 29, 2016
Intel Corporation
Naga Sivakumar Yagnamurthy
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES
Publication number
20160225707
Publication date
Aug 4, 2016
Huiyang FEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low stress stacked die packages
Publication number
20070152314
Publication date
Jul 5, 2007
Intel Corporation
Rahul Manepalli
H01 - BASIC ELECTRIC ELEMENTS