Prathap A. Reddy

Person

Farmington, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Headlamp assembly with integrated housing and heat sink
- Patent number 7,427,152
- Issue date Sep 23, 2008
- Visteon Global Technologies, Inc.
- Jeffrey Allen Erion
- F21 - LIGHTING
Information Patent Grant
Convectively cooled headlamp assembly
- Patent number 7,329,033
- Issue date Feb 12, 2008
- Visteon Global Technologies, Inc.
- Andrew Zachary Glovatsky
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Liquid cooled semiconductor device
- Patent number 6,992,887
- Issue date Jan 31, 2006
- Visteon Global Technologies, Inc.
- Vivek A. Jairazbhoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric machine with integrated power electronics
- Patent number 6,914,357
- Issue date Jul 5, 2005
- Visteon Global Technologies, Inc.
- Ben Tabatowski-Bush
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for attaching a die with a low melting metal
- Patent number 6,826,829
- Issue date Dec 7, 2004
- Visteon Global Technologies, Inc.
- Cuong Van Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-shot injection molding process for making electrical connecto...
- Patent number 6,601,296
- Issue date Aug 5, 2003
- Visteon Global Technologies, Inc.
- Daniel Phillip Dailey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Void-free die attachment method with low melting metal
- Patent number 6,601,753
- Issue date Aug 5, 2003
- Visteon Global Technologies, Inc.
- Jay DeAvis Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air manifold mounting for engine control circuitry
- Patent number 6,357,414
- Issue date Mar 19, 2002
- Visteon Global Technologies, Inc.
- Pawel Kalinowski
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Method and article for attaching high-operating-temperature electro...
- Patent number 6,274,407
- Issue date Aug 14, 2001
- Visteon Global Technologies, Inc.
- Jay DeAvis Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-operating-temperature electronic component
- Patent number 6,144,104
- Issue date Nov 7, 2000
- Visteon Corporation
- Jay DeAvis Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and electrical connector assembly
- Patent number 6,126,459
- Issue date Oct 3, 2000
- Ford Motor Company
- Prathap Amerwai Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for acoustic cooling automotive electronics
- Patent number 6,059,020
- Issue date May 9, 2000
- Ford Global Technologies, Inc.
- Vivek Amir Jairazbhoy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for cooling electronic components
- Patent number 5,986,884
- Issue date Nov 16, 1999
- Ford Motor Company
- Vivek Amir Jairazbhoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded metal planes for thermal management
- Patent number 5,792,677
- Issue date Aug 11, 1998
- Ford Motor Company
- Prathap Amerwai Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for storing and cooling electronic devices and/or modules...
- Patent number 5,669,813
- Issue date Sep 23, 1997
- Ford Motor Company
- Vivek Amir Jairazbhoy
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board with high heat dissipation
- Patent number 5,473,511
- Issue date Dec 5, 1995
- Ford Motor Company
- Prathap A. Reddy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with bi-metallic heat spreader
- Patent number 5,469,329
- Issue date Nov 21, 1995
- Ford Motor Company
- Prathap A. Reddy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Headlamp assembly with integrated housing and heat sink
- Publication number 20070127257
- Publication date Jun 7, 2007
- Visteon Global Technologies, Inc.
- Jeffrey Allen Erion
- F21 - LIGHTING
Information Patent Application
Convectively cooled headlamp assembly
- Publication number 20070091632
- Publication date Apr 26, 2007
- Visteon Global Technologies, Inc.
- Andrew Zachary Glovatsky
- B60 - VEHICLES IN GENERAL
Information Patent Application
Selective soldering of flat flexible cable with lead-free solder to...
- Publication number 20060226199
- Publication date Oct 12, 2006
- Visteon Global Technologies, Inc.
- Zhong-You Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-conductor die mount assembly
- Publication number 20060186535
- Publication date Aug 24, 2006
- Visteon Global Technologies, Inc.
- Jay D. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060061965
- Publication date Mar 23, 2006
- Visteon Global Technologies, Inc.
- Vivek A. Jairazbhoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid cooled semiconductor device
- Publication number 20050083652
- Publication date Apr 21, 2005
- Visteon Global Technologies, Inc.
- Vivek A. Jairazbhoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric thermal stack for the cooling of high power electronics
- Publication number 20050083655
- Publication date Apr 21, 2005
- Visteon Global Technologies, Inc.
- Vivek Jairazbhoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Machine integrated power
- Publication number 20030227222
- Publication date Dec 11, 2003
- Visteon Global Technologies, Inc.
- Ben Tabatowski-Bush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for attaching a die with a low melting metal
- Publication number 20030167630
- Publication date Sep 11, 2003
- Cuong Van Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-free die attachment method with low melting metal
- Publication number 20020170944
- Publication date Nov 21, 2002
- Jay DeAvis Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Evaporative cooling device and method
- Publication number 20020144802
- Publication date Oct 10, 2002
- VISTEON GLOBAL TECHNOLOGIES
- Vivek Amir Jairazbhoy
- F28 - HEAT EXCHANGE IN GENERAL

Prathap A. Reddy

Person

Patents Grantslast 30 patents

Headlamp assembly with integrated housing and heat sink

Convectively cooled headlamp assembly

Liquid cooled semiconductor device

Electric machine with integrated power electronics

Method for attaching a die with a low melting metal

Multi-shot injection molding process for making electrical connecto...

Void-free die attachment method with low melting metal

Air manifold mounting for engine control circuitry

Method and article for attaching high-operating-temperature electro...

High-operating-temperature electronic component

Substrate and electrical connector assembly

Apparatus for acoustic cooling automotive electronics

Method for cooling electronic components

Embedded metal planes for thermal management

Apparatus for storing and cooling electronic devices and/or modules...

Printed circuit board with high heat dissipation

Printed circuit board with bi-metallic heat spreader

Patents Applicationslast 30 patents

Headlamp assembly with integrated housing and heat sink

Convectively cooled headlamp assembly

Selective soldering of flat flexible cable with lead-free solder to...

Semi-conductor die mount assembly

Semiconductor device

Liquid cooled semiconductor device

Dielectric thermal stack for the cooling of high power electronics

Machine integrated power

Method for attaching a die with a low melting metal

Void-free die attachment method with low melting metal

Evaporative cooling device and method