Pratyush Mishra

Person

Tempe, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE
- Publication number 20250218915
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...
- Publication number 20250218961
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...
- Publication number 20250220819
- Publication date Jul 3, 2025
- Intel Corporation
- Pratyasha MOHAPATRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
- Publication number 20250218952
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...
- Publication number 20250201787
- Publication date Jun 19, 2025
- Intel Corporation
- Marcel M. Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240332100
- Publication date Oct 3, 2024
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS

Pratyush Mishra

Person

Patents Applicationslast 30 patents

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

Technologies for Components Embedded in a Substrate Core

PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE

METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...

COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...

SPACER FOR EMBEDDED COMPONENT IN CORE

APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES