Premjeet Chahal

Person

Gurnee, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hermetic packaging of integrated circuit components having a capaci...
- Patent number 9,142,429
- Issue date Sep 22, 2015
- Raytheon Company
- Premjeet Chahal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic packaging of integrated circuit components
- Patent number 8,803,314
- Issue date Aug 12, 2014
- Raytheon Company
- Premjeet Chahal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic packaging of integrated circuit components
- Patent number 8,343,806
- Issue date Jan 1, 2013
- Raytheon Company
- Premjeet Chahal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple substrate electrical circuit device
- Patent number 8,344,430
- Issue date Jan 1, 2013
- Raytheon Company
- Premjeet Chahal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin micropolarizing filter, and a method for making it
- Patent number 7,859,658
- Issue date Dec 28, 2010
- Raytheon Company
- Premjeet Chahal
- G02 - OPTICS
Information Patent Grant
Multiple substrate electrical circuit device
- Patent number 7,825,005
- Issue date Nov 2, 2010
- Raytheon Company
- Premjeet Chahal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of local oscillator signal generation
- Patent number 7,405,869
- Issue date Jul 29, 2008
- Raytheon Company
- Francis J. Morris
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thin micropolarizing filter, and a method for making it
- Patent number 7,098,442
- Issue date Aug 29, 2006
- Raytheon Company
- Premjeet Chahal
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS
- Publication number 20140299966
- Publication date Oct 9, 2014
- Premjeet Chahal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS
- Publication number 20130127014
- Publication date May 23, 2013
- Raytheon Company
- Premjeet Chahal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multiple Substrate Electrical Circuit Device
- Publication number 20110037151
- Publication date Feb 17, 2011
- Raytheon Company
- Premjeet Chahal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Building Multilayer Circuits
- Publication number 20100300734
- Publication date Dec 2, 2010
- Raytheon Company
- Billy D. Ables
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS
- Publication number 20100224980
- Publication date Sep 9, 2010
- Raytheon Company
- Premjeet Chahal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for sealing vias in a substrate
- Publication number 20080099537
- Publication date May 1, 2008
- Raytheon Company
- Premjeet Chahal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin Micropolarizing Filter, and a Method for Making It
- Publication number 20060284056
- Publication date Dec 21, 2006
- Raytheon Company
- Premjeet (nmi) Chahal
- G02 - OPTICS
Information Patent Application
Micropolarizing filter, and a method for making it
- Publication number 20040173730
- Publication date Sep 9, 2004
- Premjeet Chahal
- G02 - OPTICS

Premjeet Chahal

Person

Patents Grantslast 30 patents

Hermetic packaging of integrated circuit components having a capaci...

Hermetic packaging of integrated circuit components

Hermetic packaging of integrated circuit components

Multiple substrate electrical circuit device

Thin micropolarizing filter, and a method for making it

Multiple substrate electrical circuit device

Method and system of local oscillator signal generation

Thin micropolarizing filter, and a method for making it

Patents Applicationslast 30 patents

HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS

HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS

Multiple Substrate Electrical Circuit Device

Method and Apparatus for Building Multilayer Circuits

HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS

Method for sealing vias in a substrate

Thin Micropolarizing Filter, and a Method for Making It

Micropolarizing filter, and a method for making it