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Patents Grants
last 30 patents
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,996,345
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy die placement without backside chipping
Patent number
11,990,429
Issue date
May 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coplanar control for film-type thermal interface
Patent number
11,973,005
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,923,259
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,869,822
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,855,003
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,855,060
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of the same
Patent number
11,854,877
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacture
Patent number
11,830,821
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package using jig
Patent number
11,804,468
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,742,323
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High efficiency heat dissipation using thermal interface material film
Patent number
11,705,381
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,521,905
Issue date
Dec 6, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy die placement without backside chipping
Patent number
11,515,267
Issue date
Nov 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,450,654
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,289,399
Issue date
Mar 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,205,615
Issue date
Dec 21, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Ju Tsou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for forming the same
Patent number
11,152,330
Issue date
Oct 19, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Chieh Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,139,285
Issue date
Oct 5, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Ju Tsou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of the same
Patent number
10,964,673
Issue date
Mar 30, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package of integrated circuits having a light-to-heat-conversion co...
Patent number
10,916,450
Issue date
Feb 9, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Ju Tsou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and methods of forming the same
Patent number
10,867,965
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Ching Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy die placement without backside chipping
Patent number
10,861,799
Issue date
Dec 8, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
10,586,763
Issue date
Mar 10, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Ju Tsou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of the same
Patent number
10,535,639
Issue date
Jan 14, 2020
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and methods of forming the same
Patent number
10,529,690
Issue date
Jan 7, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Ching Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
PoP device and method of forming the same
Patent number
10,510,732
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Ju Tsou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, method for forming semiconductor package, an...
Patent number
10,497,690
Issue date
Dec 3, 2019
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Ju Tsou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of the same
Patent number
10,290,609
Issue date
May 14, 2019
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a release film as isolation film in package
Patent number
10,269,589
Issue date
Apr 23, 2019
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Ju Tsou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240087954
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
JING-CHENG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240071847
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Huan Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240071857
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240038623
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
Publication number
20240014100
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-TIM PACKAGES AND METHOD FORMING SAME
Publication number
20230378020
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230378130
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20230378017
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
Publication number
20230369283
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Efficiency Heat Dissipation Using Thermal Interface Material Film
Publication number
20230317552
Publication date
Oct 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230290704
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dummy Die Placement Without Backside Chipping
Publication number
20230092361
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230075735
Publication date
Mar 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230065884
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230048302
Publication date
Feb 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230026141
Publication date
Jan 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230021005
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Chih Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat Dissipation Structures for Integrated Circuit Packages and Met...
Publication number
20230014913
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING AN INNER FOOT AND M...
Publication number
20230018359
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company Limited
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20220406676
Publication date
Dec 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM
Publication number
20220392823
Publication date
Dec 8, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacture
Publication number
20220384355
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20220367383
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
Publication number
20220359345
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-TIM Packages and Method Forming Same
Publication number
20220359339
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Yin Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20220359487
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20220344304
Publication date
Oct 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...
Publication number
20220230985
Publication date
Jul 21, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES
Publication number
20220157692
Publication date
May 19, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220122896
Publication date
Apr 21, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS