Punit P. Chiniwalla

Person

New York, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon based optical vias
- Patent number 8,755,644
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...
- Patent number 7,883,277
- Issue date Feb 8, 2011
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Coupling element alignment using waveguide fiducials
- Patent number 7,853,105
- Issue date Dec 14, 2010
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Mixed electrical and optical LGA interposer for facilitating chip t...
- Patent number 7,613,368
- Issue date Nov 3, 2009
- International Business Machines Corporation
- Gareth G. Hougham
- G02 - OPTICS
Information Patent Grant
Coupling element alignment using waveguide fiducials
- Patent number 7,542,643
- Issue date Jun 2, 2009
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Chip to Chip optical interconnect
- Patent number 7,480,429
- Issue date Jan 20, 2009
- International Business Machines Corporation
- Punit P. Chiniwalla
- G02 - OPTICS
Information Patent Grant
Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...
- Patent number 7,474,815
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Coupling element alignment using waveguide fiducials
- Patent number 7,421,160
- Issue date Sep 2, 2008
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Medium containing optical paths and electrically conducting paths f...
- Patent number 7,367,715
- Issue date May 6, 2008
- International Business Machines Corporation
- Russell A. Budd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon based optical vias
- Patent number 7,352,066
- Issue date Apr 1, 2008
- International Business Machines Corporation
- Russell A. Budd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Silicon based optical vias
- Publication number 20100322551
- Publication date Dec 23, 2010
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
Coupling Element Alignment Using Waveguide Fiducials
- Publication number 20090202203
- Publication date Aug 13, 2009
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
CHIP TO CHIP OPTICAL INTERCONNECT
- Publication number 20090003762
- Publication date Jan 1, 2009
- International Business Machines Corporation
- Punit P. Chiniwalla
- G02 - OPTICS
Information Patent Application
COUPLING ELEMENT ALIGNMENT USING WAVEGUIDE FIDUCIALS
- Publication number 20080285920
- Publication date Nov 20, 2008
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
INTERCONNECTING (MAPPING) A TWO-DIMENSIONAL OPTOELECTRONIC (OE) DEV...
- Publication number 20080205817
- Publication date Aug 28, 2008
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...
- Publication number 20070217750
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
Silicon based optical vias
- Publication number 20070085215
- Publication date Apr 19, 2007
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
Mixed electrical and optical LGA interposer for facilitating chip t...
- Publication number 20060105607
- Publication date May 18, 2006
- International Business Machines Corporation
- Gareth G. Hougham
- G02 - OPTICS

Punit P. Chiniwalla

Person

Patents Grantslast 30 patents

Silicon based optical vias

Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...

Coupling element alignment using waveguide fiducials

Mixed electrical and optical LGA interposer for facilitating chip t...

Coupling element alignment using waveguide fiducials

Chip to Chip optical interconnect

Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...

Coupling element alignment using waveguide fiducials

Medium containing optical paths and electrically conducting paths f...

Silicon based optical vias

Patents Applicationslast 30 patents

Silicon based optical vias

Coupling Element Alignment Using Waveguide Fiducials

CHIP TO CHIP OPTICAL INTERCONNECT

COUPLING ELEMENT ALIGNMENT USING WAVEGUIDE FIDUCIALS

INTERCONNECTING (MAPPING) A TWO-DIMENSIONAL OPTOELECTRONIC (OE) DEV...

Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...

Silicon based optical vias

Mixed electrical and optical LGA interposer for facilitating chip t...