TREA

Pyoungwan Kim

Follow

Person

  • Gyeonggi-do, KR
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210335756
    • Publication date Oct 28, 2021
    • Samsung Electronics Co., Ltd.
    • Jinkyeong SEOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGED SEMICONDUCTOR DEVICES HAVING ENHANCED THERMAL TRANSPORT AN...
    • Publication number 20210104446
    • Publication date Apr 8, 2021
    • Samsung Electronics Co., Ltd.
    • Sunchul Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210082881
    • Publication date Mar 18, 2021
    • Samsung Electronics Co., Ltd.
    • Jinkyeong SEOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210066244
    • Publication date Mar 4, 2021
    • Samsung Electronics Co., Ltd.
    • Sunchul KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210057380
    • Publication date Feb 25, 2021
    • Samsung Electronics Co., Ltd.
    • Sunchul KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200098734
    • Publication date Mar 26, 2020
    • Samsung Electronics Co., Ltd.
    • CHANHEE JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20190067258
    • Publication date Feb 28, 2019
    • Samsung Electronics Co., Ltd.
    • Yun-Young KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20180145061
    • Publication date May 24, 2018
    • Samsung Electronics Co., Ltd.
    • CHANHEE JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20160099213
    • Publication date Apr 7, 2016
    • Samsung Electronics Co., Ltd.
    • Yujung TAE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES
    • Publication number 20130126219
    • Publication date May 23, 2013
    • Samsung Electronics Co., Ltd.
    • Pyoungwan Kim
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METHODS OF FORMING THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCT...
    • Publication number 20110318917
    • Publication date Dec 29, 2011
    • Minseung Yoon
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCTIVE PROTECTIVE LAYE...
    • Publication number 20100038800
    • Publication date Feb 18, 2010
    • SAMSUNG ELECTRONICS CO., LTD.
    • Minseung Yoon
    • H01 - BASIC ELECTRIC ELEMENTS