Qiao Chen

Person

Atlanta, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit with metal stop ring outside the scribe seal
- Patent number 12,009,319
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
- Patent number 10,672,718
- Issue date Jun 2, 2020
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
- Patent number 9,275,934
- Issue date Mar 1, 2016
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTO...
- Publication number 20240363462
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20240234231
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20220059423
- Publication date Feb 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH METAL STOP RING OUTSIDE THE SCRIBE SEAL
- Publication number 20210210440
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND ME...
- Publication number 20160141257
- Publication date May 19, 2016
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Package-Via (TPV) Structures On Inorganic Interposer And Me...
- Publication number 20130119555
- Publication date May 16, 2013
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AN...
- Publication number 20120261805
- Publication date Oct 18, 2012
- Georgia Tech Research Corporation
- VENKATESH V. SUNDARAM
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit with metal stop ring outside the scribe seal

Electronic devices in semiconductor package cavities

Through-package-via (TPV) structures on inorganic interposer and me...

Through-package-via (TPV) structures on inorganic interposer and me...

Patents Applicationslast 30 patents

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTO...

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

INTEGRATED CIRCUIT WITH METAL STOP RING OUTSIDE THE SCRIBE SEAL

THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND ME...

Through-Package-Via (TPV) Structures On Inorganic Interposer And Me...

THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AN...