Qin Peng

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Chengdu, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH STEPPED CONDUCTIVE TERMINALS
- Publication number 20250112133
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE
- Publication number 20250069999
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR