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Qing Zhou
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-chip assembly with optically coupled die
Patent number
8,189,361
Issue date
May 29, 2012
Intel Corporation
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming compliant contact pads for semiconductor packages
Patent number
8,148,805
Issue date
Apr 3, 2012
Intel Corporation
Qing Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated micro-channels for 3D through silicon architectures
Patent number
8,012,808
Issue date
Sep 6, 2011
Intel Corporation
Wei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate with raised edge pads
Patent number
7,980,865
Issue date
Jul 19, 2011
Intel Corporation
Wei Shi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Forming compliant contact pads for semiconductor packages
Patent number
7,939,922
Issue date
May 10, 2011
Intel Corporation
Qing Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-chip assembly with optically coupled die
Patent number
7,851,809
Issue date
Dec 14, 2010
Intel Corporation
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip assembly with optically coupled die
Patent number
7,564,066
Issue date
Jul 21, 2009
Intel Corporation
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly with stacked IC's using two or more different c...
Patent number
7,554,203
Issue date
Jun 30, 2009
Intel Corporation
Qing A Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming compliant contact pads for semiconductor packages
Patent number
7,538,019
Issue date
May 26, 2009
Intel Corporation
Qing Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated micro-channels for 3D through silicon architectures
Patent number
7,432,592
Issue date
Oct 7, 2008
Intel Corporation
Wei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package to provide high-bandwidth communication...
Patent number
7,348,678
Issue date
Mar 25, 2008
Intel Corporation
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Substrate With Raised Edge Pads
Publication number
20110239454
Publication date
Oct 6, 2011
Wei Shi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Forming Compliant Contact Pads for Semiconductor Packages
Publication number
20110175230
Publication date
Jul 21, 2011
Qing Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE
Publication number
20110058419
Publication date
Mar 10, 2011
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip assembly with optically coupled die
Publication number
20090250707
Publication date
Oct 8, 2009
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming Compliant Contact Pads For Semiconductor Packages
Publication number
20090200681
Publication date
Aug 13, 2009
Qing Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES
Publication number
20090201643
Publication date
Aug 13, 2009
Wei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic package, method of manufacturing same, and system c...
Publication number
20080067668
Publication date
Mar 20, 2008
Wei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ASSEMBLY WITH STACKED IC'S USING TWO OR MORE DIFFERENT C...
Publication number
20080003717
Publication date
Jan 3, 2008
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Edge interconnects for die stacking
Publication number
20070158807
Publication date
Jul 12, 2007
Daoqiang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate with raised edge pads
Publication number
20070155198
Publication date
Jul 5, 2007
Wei Shi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Fluxless heat spreader bonding with cold form solder
Publication number
20070152321
Publication date
Jul 5, 2007
Wei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package to provide high-bandwidth communication...
Publication number
20070138647
Publication date
Jun 21, 2007
Qing Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming compliant contact pads for semiconductor packages
Publication number
20070132106
Publication date
Jun 14, 2007
Qing Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-chip assembly with optically coupled die
Publication number
20070102733
Publication date
May 10, 2007
Qing A. Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated micro-channels for 3D through silicon architectures
Publication number
20070085198
Publication date
Apr 19, 2007
Wei Shi
H01 - BASIC ELECTRIC ELEMENTS