Qingyun Chen

Person

Branford, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 9,613,858
- Issue date Apr 4, 2017
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,771,495
- Issue date Jul 8, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,388,824
- Issue date Mar 5, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface preparation process for damascene copper deposition
- Patent number 7,998,859
- Issue date Aug 16, 2011
- Enthone Inc.
- Qingyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper deposition for filling features in manufacture of microelect...
- Patent number 7,968,455
- Issue date Jun 28, 2011
- Enthone Inc.
- Xuan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacture of electroless cobalt deposition compositions for micro...
- Patent number 7,704,306
- Issue date Apr 27, 2010
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,615,491
- Issue date Nov 10, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,987
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,988
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,410,899
- Issue date Aug 12, 2008
- Enthone, Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,393,781
- Issue date Jul 1, 2008
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cobalt and nickel electroless plating in microelectronic devices
- Patent number 7,332,193
- Issue date Feb 19, 2008
- Enthone, Inc.
- Charles Valverde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,268,074
- Issue date Sep 11, 2007
- Enthone, Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20140322912
- Publication date Oct 30, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20130241060
- Publication date Sep 19, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECT...
- Publication number 20100285660
- Publication date Nov 11, 2010
- Enthone Inc.
- Xuan Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASE...
- Publication number 20100126872
- Publication date May 27, 2010
- ENTHONE, INC.
- Vincent Paneccasio, JR.
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION
- Publication number 20100075496
- Publication date Mar 25, 2010
- Enthone Inc.
- Qingyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY IN ELECTROLESS COBALT PLATING
- Publication number 20090155468
- Publication date Jun 18, 2009
- Enthone Inc.
- Nicolai Petrov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPO...
- Publication number 20080254205
- Publication date Oct 16, 2008
- Enthone Inc.
- Nicolai Petrov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE
- Publication number 20080236619
- Publication date Oct 2, 2008
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICRO...
- Publication number 20080090414
- Publication date Apr 17, 2008
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...
- Publication number 20070298609
- Publication date Dec 27, 2007
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066057
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066059
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070062408
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066058
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt electroless plating in microelectronic devices
- Publication number 20060280860
- Publication date Dec 14, 2006
- Enthone Inc.
- Vincent Paneccasio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt self-initiated electroless via fill for stacked memory cells
- Publication number 20060188659
- Publication date Aug 24, 2006
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt and nickel electroless plating in microelectronic devices
- Publication number 20060083850
- Publication date Apr 20, 2006
- Enthone Inc.
- Charles Valverde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Capping of metal interconnects in integrated circuit electronic dev...
- Publication number 20050275100
- Publication date Dec 15, 2005
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Qingyun Chen

Person

Patents Grantslast 30 patents

Method and composition for electrodeposition of copper in microelec...

Method and composition for electrodeposition of copper in microelec...

Method and composition for electrodeposition of copper in microelec...

Surface preparation process for damascene copper deposition

Copper deposition for filling features in manufacture of microelect...

Manufacture of electroless cobalt deposition compositions for micro...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Capping of metal interconnects in integrated circuit electronic dev...

Cobalt and nickel electroless plating in microelectronic devices

Capping of metal interconnects in integrated circuit electronic dev...

Patents Applicationslast 30 patents

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECT...

ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASE...

SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION

METROLOGY IN ELECTROLESS COBALT PLATING

SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPO...

COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE

MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICRO...

CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Cobalt electroless plating in microelectronic devices

Cobalt self-initiated electroless via fill for stacked memory cells

Cobalt and nickel electroless plating in microelectronic devices

Capping of metal interconnects in integrated circuit electronic dev...