Qiuxiao Qian

Person

Singapore, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package including IC driver and bridge
- Patent number 8,674,490
- Issue date Mar 18, 2014
- Fairchild Semiconductor Corporatio
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor power modules and packages
- Patent number 8,421,204
- Issue date Apr 16, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded die package on package (POP) with pre-molded leadframe
- Patent number 8,389,338
- Issue date Mar 5, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four MOSFET full bridge module
- Patent number 8,367,481
- Issue date Feb 5, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four mosfet full bridge module
- Patent number 8,138,585
- Issue date Mar 20, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die package on package (POP) with pre-molded leadframe
- Patent number 8,063,474
- Issue date Nov 22, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stacked dice for a buck converter
- Patent number 8,063,472
- Issue date Nov 22, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FLMP buck converter with a molded capacitor and a method of the same
- Patent number 8,023,279
- Issue date Sep 20, 2011
- Fairchild Semiconductor Corporation
- Qiuxiao Qian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package including multiple semiconductor dice
- Patent number 8,018,054
- Issue date Sep 13, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including IC driver and bridge
- Patent number 7,915,721
- Issue date Mar 29, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking quad pre-molded component packages, systems using the same...
- Patent number 7,829,988
- Issue date Nov 9, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages having overlapping dice, system using th...
- Patent number 7,825,502
- Issue date Nov 2, 2010
- Fairchild Semiconductor Corporation
- Scott Irving
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual-die packages, methods of making, and systems incorpora...
- Patent number 7,768,123
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter
- Patent number 7,750,445
- Issue date Jul 6, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Pin substrate and package
- Patent number 7,745,244
- Issue date Jun 29, 2010
- Fairchild Semiconductor Corporation
- Zhongfa Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FOUR MOSFET FULL BRIDGE MODULE
- Publication number 20130005083
- Publication date Jan 3, 2013
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL MOLDED OPTO-COUPLERS
- Publication number 20120326170
- Publication date Dec 27, 2012
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR POWER MODULES AND PACKAGES
- Publication number 20120292778
- Publication date Nov 22, 2012
- Yong Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOUR MOSFET FULL BRIDGE MODULE
- Publication number 20120149149
- Publication date Jun 14, 2012
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGE ON PACKAGE (POP) WITH PRE-MOLDED LEADFRAME
- Publication number 20120094436
- Publication date Apr 19, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE
- Publication number 20110140255
- Publication date Jun 16, 2011
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLMP BUCK CONVERTER WITH A MOLDED CAPACITOR
- Publication number 20100232131
- Publication date Sep 16, 2010
- Qiuxiao Qian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stacking Quad Pre-Molded Component Packages, Systems Using the Same...
- Publication number 20100072590
- Publication date Mar 25, 2010
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN SUBSTRATE AND PACKAGE
- Publication number 20090315171
- Publication date Dec 24, 2009
- Zhongfa Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOUR MOSFET FULL BRIDGE MODULE
- Publication number 20090294936
- Publication date Dec 3, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Micro-Module Packages, Systems Using the Same, and Methods...
- Publication number 20090256245
- Publication date Oct 15, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE
- Publication number 20090230518
- Publication date Sep 17, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DICE
- Publication number 20090230536
- Publication date Sep 17, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGE ON PACKAGE (POP) WITH PRE-MOLDED LEADFRAME
- Publication number 20090194887
- Publication date Aug 6, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED DICE FOR A BUCK CONVERTER
- Publication number 20090189266
- Publication date Jul 30, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Packages Having Overlapping Dice, System Using th...
- Publication number 20090174047
- Publication date Jul 9, 2009
- Scott Irving
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Dual-Die Packages, Methods of Making, and Systems Incorpora...
- Publication number 20090079092
- Publication date Mar 26, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Qiuxiao Qian

Person

Patents Grantslast 30 patents

Semiconductor die package including IC driver and bridge

Embedded semiconductor power modules and packages

Embedded die package on package (POP) with pre-molded leadframe

Four MOSFET full bridge module

Four mosfet full bridge module

Embedded die package on package (POP) with pre-molded leadframe

Semiconductor package with stacked dice for a buck converter

FLMP buck converter with a molded capacitor and a method of the same

Semiconductor die package including multiple semiconductor dice

Semiconductor die package including IC driver and bridge

Stacking quad pre-molded component packages, systems using the same...

Semiconductor die packages having overlapping dice, system using th...

Stacked dual-die packages, methods of making, and systems incorpora...

Stacked synchronous buck converter

Pin substrate and package

Patents Applicationslast 30 patents

FOUR MOSFET FULL BRIDGE MODULE

WAFER LEVEL MOLDED OPTO-COUPLERS

EMBEDDED SEMICONDUCTOR POWER MODULES AND PACKAGES

FOUR MOSFET FULL BRIDGE MODULE

EMBEDDED DIE PACKAGE ON PACKAGE (POP) WITH PRE-MOLDED LEADFRAME

SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE

FLMP BUCK CONVERTER WITH A MOLDED CAPACITOR

Stacking Quad Pre-Molded Component Packages, Systems Using the Same...

PIN SUBSTRATE AND PACKAGE

FOUR MOSFET FULL BRIDGE MODULE

Stacked Micro-Module Packages, Systems Using the Same, and Methods...

SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DICE

EMBEDDED DIE PACKAGE ON PACKAGE (POP) WITH PRE-MOLDED LEADFRAME

SEMICONDUCTOR PACKAGE WITH STACKED DICE FOR A BUCK CONVERTER

Semiconductor Die Packages Having Overlapping Dice, System Using th...

Stacked Dual-Die Packages, Methods of Making, and Systems Incorpora...