Quang Nguyen

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 12,211,814
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 11,728,307
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with spaces for embedding components
- Patent number 11,664,360
- Issue date May 30, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with spaces for embedding components
- Patent number 11,217,576
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...
- Publication number 20250014959
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Manish Nayini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT
- Publication number 20240407080
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES
- Publication number 20240339496
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING CRACKS ON A SUBSTRATE VIA
- Publication number 20240155767
- Publication date May 9, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A THERMALLY-CONDUCTIVE CHANNEL
- Publication number 20240145337
- Publication date May 2, 2024
- Koustav SINHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A DAMPER FOR A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240117855
- Publication date Apr 11, 2024
- Micron Technology, Inc.
- Kaleb A. Wilson
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20230335522
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...
- Publication number 20230290738
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...
- Publication number 20230260943
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Christopher Glancey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR USING STRUCTURAL ELEMENTS TO IMPROVE DROP...
- Publication number 20230061955
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Koustav Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20220344295
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS
- Publication number 20220122958
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS
- Publication number 20220085002
- Publication date Mar 17, 2022
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Quang Nguyen

Person

Patents Grantslast 30 patents

Semiconductor interconnect structures with conductive elements, and...

Semiconductor interconnect structures with conductive elements, and...

Circuit board with spaces for embedding components

Circuit board with spaces for embedding components

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...

PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT

SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES

FILLING CRACKS ON A SUBSTRATE VIA

SEMICONDUCTOR DEVICE ASSEMBLY WITH A THERMALLY-CONDUCTIVE CHANNEL

A DAMPER FOR A PRINTED CIRCUIT BOARD ASSEMBLY

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...

SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...

METHODS AND APPARATUS FOR USING STRUCTURAL ELEMENTS TO IMPROVE DROP...

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS

CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS