Quinn K. Tong

Person

Belle Mead, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
B-stageable underfill encapsulant and method for its application
- Patent number 7,608,487
- Issue date Oct 27, 2009
- Henkel AG & Co.KGaA
- Allison Yue Xiao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill encapsulant for wafer packaging and method for its applic...
- Patent number 7,037,399
- Issue date May 2, 2006
- National Starch and Chemical Investment Holding Corporation
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pre-applied fluxing underfill composition having pressure sensitive...
- Patent number 7,004,375
- Issue date Feb 28, 2006
- National Starch and Chemical Investment Holding Corporation
- Jayesh Shah
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dual cure B-stageable underfill for wafer level
- Patent number 6,833,629
- Issue date Dec 21, 2004
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package encapsulant compositions for use in electronic devices
- Patent number 6,350,838
- Issue date Feb 26, 2002
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive and resistive materials with electrical stability for us...
- Patent number 6,344,157
- Issue date Feb 5, 2002
- National Starch and Chemical Investment Holding Corporation
- Chih-Min Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package encapsulant compositions for use in electronic devices
- Patent number 6,316,566
- Issue date Nov 13, 2001
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compositions for use in the fabrication of circuit components and p...
- Patent number 6,281,314
- Issue date Aug 28, 2001
- National Starch and Chemical Investment Holding Corporation
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of making an electronic component using reworkable underfill...
- Patent number 6,180,187
- Issue date Jan 30, 2001
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill encapsulant compositions for use in electronic devices
- Patent number 6,063,828
- Issue date May 16, 2000
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of making an electronic component using reworkable underfill...
- Patent number 6,057,381
- Issue date May 2, 2000
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Snap-cure epoxy adhesives
- Patent number 5,856,383
- Issue date Jan 5, 1999
- National Starch and Chemical Investment Holding Corporation
- Bing Wu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Snap-cure epoxy adhesives
- Patent number 5,854,315
- Issue date Dec 29, 1998
- National Starch and Chemical Investment Holding Corporation
- Bing Wu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Flexible epoxy adhesives with low bleeding tendency
- Patent number 5,807,959
- Issue date Sep 15, 1998
- National Starch and Chemical Investment Holding Corporation
- Bing Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Snap-cure epoxy adhesives
- Patent number 5,770,706
- Issue date Jun 23, 1998
- National Starch and Chemical Investment Holding Corporation
- Bing Wu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Hot melt adhesive compositions with improved wicking properties
- Patent number 5,685,758
- Issue date Nov 11, 1997
- National Starch and Chemical Investment Holding Corporation
- Charles W. Paul
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Acrylic hair fixatives and methods of making same
- Patent number 5,686,062
- Issue date Nov 11, 1997
- National Starch and Chemical Investment Holding Corporation
- Quinn Kun Tong
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Aqueous, acrylic hair fixatives and methods of making same
- Patent number 5,620,683
- Issue date Apr 15, 1997
- National Starch and Chemical Investment Holding Corporation
- Quinn K. Tong
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
B-stageable underfill encapsulant and method for its application
- Publication number 20060125119
- Publication date Jun 15, 2006
- Allison Yue Xiao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Pre-applied fluxing underfill composition having pressure sensitive...
- Publication number 20040232210
- Publication date Nov 25, 2004
- Jayesh Shah
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Underfill encapsulant for wafer packaging and method for its applic...
- Publication number 20030171456
- Publication date Sep 11, 2003
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
B-stageable underfill encapsulant and method for its application
- Publication number 20030164555
- Publication date Sep 4, 2003
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
No flow underfill composition
- Publication number 20030162911
- Publication date Aug 28, 2003
- Yue Xiao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dual cure B-stageable underfill for wafer level
- Publication number 20030141592
- Publication date Jul 31, 2003
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Package encapsulant compositions for use in electronic devices
- Publication number 20010056162
- Publication date Dec 27, 2001
- Bodan Ma
- H01 - BASIC ELECTRIC ELEMENTS

Quinn K. Tong

Person

Patents Grantslast 30 patents

B-stageable underfill encapsulant and method for its application

Underfill encapsulant for wafer packaging and method for its applic...

Pre-applied fluxing underfill composition having pressure sensitive...

Dual cure B-stageable underfill for wafer level

Package encapsulant compositions for use in electronic devices

Conductive and resistive materials with electrical stability for us...

Package encapsulant compositions for use in electronic devices

Compositions for use in the fabrication of circuit components and p...

Method of making an electronic component using reworkable underfill...

Underfill encapsulant compositions for use in electronic devices

Method of making an electronic component using reworkable underfill...

Snap-cure epoxy adhesives

Snap-cure epoxy adhesives

Flexible epoxy adhesives with low bleeding tendency

Snap-cure epoxy adhesives

Hot melt adhesive compositions with improved wicking properties

Acrylic hair fixatives and methods of making same

Aqueous, acrylic hair fixatives and methods of making same

Patents Applicationslast 30 patents

B-stageable underfill encapsulant and method for its application

Pre-applied fluxing underfill composition having pressure sensitive...

Underfill encapsulant for wafer packaging and method for its applic...

B-stageable underfill encapsulant and method for its application

No flow underfill composition

Dual cure B-stageable underfill for wafer level

Package encapsulant compositions for use in electronic devices