Claims
- 1. A method for reducing the bleeding of an epoxy resin composition onto a silicon, metallic, or metallized substrate, wherein the epoxy resin composition contains 1-allyloxy-2,6-di (2,3-epoxypropyl)benzene, a curing catalyst and a filler, said method comprising admixing the epoxy resin composition with an effective amount of a polyhydroxyl compound having two or more hydroxyl groups, or an effective amount of a monohydroxyl compound having one or more phenyl groups.
- 2. A method according to claim 1, in the which the polyhydroxyl or monohydroxyl compound is selected from the group consisting of resorcinol, bisphenol A, 4,-4'-biphenol, 4-benzyloxy phenol, bisphenol F, 3,4-dimethyl phenol, styrene glycol, phenylethyl alcohol, 1,3-dioxane-5,5-dimethanol, ribonic-gamma-lactone, ethylene glycol, glycerol and phenol novolac resin.
- 3. A semiconductor device consisting of a silicon chip or die bonded to a metallic or metallized lead frame, wherein the chip or die is bonded with an epoxy resin composition which has been prepared by the process of claim 1.
- 4. A semiconductor device consisting of a silicon chip or die bonded to a metallic or metallized lead frame, wherein the chip or die is bonded with an epoxy resin composition prepared by the process of claim 2.
Parent Case Info
This is a continuation-in-part of patent application Ser. No. 08/576,725, filed Dec. 21, 1995, now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
2965607 |
Martin et al. |
Dec 1960 |
|
Non-Patent Literature Citations (1)
Entry |
Chemical Abstracts 12034a, "Allyl 2,4,6-Triallylphenyl Ether and Derivatives", Mar. 1960. |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
576725 |
Dec 1995 |
|