Raed A. Sherif

Person

Woodland Hills, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package with low stress hermetic seal
- Patent number 6,459,160
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and heat-sink cap combination
- Patent number 6,373,133
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar module array with reconfigurable tile
- Patent number 6,350,944
- Issue date Feb 26, 2002
- Hughes Electronics Corporation
- Raed A. Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress hermetic seal
- Patent number 6,342,407
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural support for direct lid attach
- Patent number 6,333,460
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Hilton T. Toy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable thermal exchanger and method thereof
- Patent number 6,330,157
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling thermal interface gap distance
- Patent number 6,294,408
- Issue date Sep 25, 2001
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a thermal path through particles embedded in a...
- Patent number 6,255,139
- Issue date Jul 3, 2001
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly with load-bearing lid in thermal contact with the chip
- Patent number 6,222,263
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Raed Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlling thermal interface gap distance
- Patent number 6,218,730
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Hilton T. Toy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal cap with embedded particles
- Patent number 6,111,314
- Issue date Aug 29, 2000
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module adjustment design and process using shims
- Patent number 6,049,456
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic CBGA/CCGA structure with thermal paste cooling
- Patent number 5,990,418
- Issue date Nov 23, 1999
- International Business Machines Corporation
- Kevin G. Bivona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip heat-sink cap assembly
- Patent number 5,981,310
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low strain seal
- Patent number 5,977,625
- Issue date Nov 2, 1999
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for flat plate cooling a semiconductor chip using a thermal...
- Patent number 5,891,755
- Issue date Apr 6, 1999
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates and process
- Patent number 5,881,945
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates
- Patent number 5,881,944
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integral mesh flat plate cooling module
- Patent number 5,825,087
- Issue date Oct 20, 1998
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cooling of chips using blind holes with customized depth
- Patent number 5,819,402
- Issue date Oct 13, 1998
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral mesh flat plate cooling method
- Patent number 5,770,478
- Issue date Jun 23, 1998
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling of chips using blind holes with customized depth
- Patent number 5,757,620
- Issue date May 26, 1998
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cooling of chips using a plurality of cust...
- Patent number 5,724,729
- Issue date Mar 10, 1998
- International Business Machines Corporation
- Raed A. Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low strain seal
- Patent number 5,723,905
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat plate cooling using a thermal paste retainer
- Patent number 5,706,171
- Issue date Jan 6, 1998
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling of chips using a plurality of customized ther...
- Patent number 5,623,394
- Issue date Apr 22, 1997
- International Business Machines Corporation
- Raed A. Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cooling of chips using a plurality of materials
- Patent number 5,604,978
- Issue date Feb 25, 1997
- International Business Machines Corporation
- Raed A. Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blind hole cold plate cooling system
- Patent number 5,239,443
- Issue date Aug 24, 1993
- International Business Machines Corporation
- Albert J. Fahey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package with low stress hermetic seal
- Publication number 20020090761
- Publication date Jul 11, 2002
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS

Raed A. Sherif

Person

Patents Grantslast 30 patents

Package with low stress hermetic seal

Multi-chip module and heat-sink cap combination

Solar module array with reconfigurable tile

Low stress hermetic seal

Structural support for direct lid attach

Variable thermal exchanger and method thereof

Method for controlling thermal interface gap distance

Method for providing a thermal path through particles embedded in a...

Chip assembly with load-bearing lid in thermal contact with the chip

Apparatus for controlling thermal interface gap distance

Thermal cap with embedded particles

Electronic module adjustment design and process using shims

Hermetic CBGA/CCGA structure with thermal paste cooling

Multi-chip heat-sink cap assembly

Semiconductor package with low strain seal

Process for flat plate cooling a semiconductor chip using a thermal...

Multi-layer solder seal band for semiconductor substrates and process

Multi-layer solder seal band for semiconductor substrates

Integral mesh flat plate cooling module

Method for cooling of chips using blind holes with customized depth

Integral mesh flat plate cooling method

Apparatus for cooling of chips using blind holes with customized depth

Method and apparatus for cooling of chips using a plurality of cust...

Semiconductor package with low strain seal

Flat plate cooling using a thermal paste retainer

Apparatus for cooling of chips using a plurality of customized ther...

Method for cooling of chips using a plurality of materials

Blind hole cold plate cooling system

Patents Applicationslast 30 patents

Package with low stress hermetic seal