Claims
- 1. A method for cooling at least one integrated circuit chip mounted on a substrate comprising:
- providing a substrate having at least one chip mounted thereon;
- providing a cooling plate overlying the substrate and the chip;
- providing a thermal paste or thermal adhesive between an upper surface of the chip and a lower surface of the cooling plate wherein the thickness of the paste or adhesive is above about 1 mil;
- wherein the lower surface of the cooling plate has a roughened surface wherein the roughened surface comprises channels which channels form a plurality of corresponding protrusions which roughened surface penetrates and improves the adhesion of the thermal paste and/or thermal conductive adhesive and inhibits the flow of thermal paste from between the upper surface of the chip and the lower surface of the cooling plate.
- 2. The method of claim 1 wherein the ratio of the width of the protrusion to the width of the channel is about 2:1 to 1:10 and the protrusions are a plurality of parallel protrusions.
- 3. The method of claim 1 wherein the parallel protrusions have a width less than about 1 mm.
- 4. The method of claim 2 wherein the protrusions are discrete and are formed by a plurality of criss-crossing channels.
- 5. The method of claim 4 wherein the protrusions have a width less than about 1 mm.
- 6. The method of claim 2 wherein the periphery of the roughened area which periphery overlies only the periphery of the chip.
Parent Case Info
This is a divisional of copending application(s) Ser. No. 08/758,789 filed on Dec. 3, 1996.
US Referenced Citations (10)
Foreign Referenced Citations (1)
Number |
Date |
Country |
63-293928 |
Nov 1988 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
758789 |
Dec 1996 |
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