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Rafael Jose Lizares GUEVARA III

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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device with solder on pillar
    • Patent number 12,107,062
    • Issue date Oct 1, 2024
    • Texas Instruments Incorporated
    • Rafael Jose Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Conductive members for die attach in flip chip packages
    • Patent number 12,100,678
    • Issue date Sep 24, 2024
    • Texas Instruments Incorporated
    • Christopher Daniel Manack
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Conductive terminal for side facing packages
    • Patent number 12,080,667
    • Issue date Sep 3, 2024
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Integral redistribution layer for WCSP
    • Patent number 12,009,272
    • Issue date Jun 11, 2024
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip chip package assembly
    • Patent number 11,929,308
    • Issue date Mar 12, 2024
    • Texas Instruments Incorporated
    • Steffany Ann Lacierda Moreno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip chip package assembly
    • Patent number 11,876,065
    • Issue date Jan 16, 2024
    • Texas Instruments Incorporated
    • Katleen Fajardo Timbol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device with passivated magnetic concentrator
    • Patent number 11,864,471
    • Issue date Jan 2, 2024
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • G01 - MEASURING TESTING
  • Information Patent Grant

    IC having electrically isolated warpage prevention structures
    • Patent number 11,862,576
    • Issue date Jan 2, 2024
    • Texas Instruments Incorporated
    • Christlyn Faith Hobrero Arias
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Conductive member cavities
    • Patent number 11,699,639
    • Issue date Jul 11, 2023
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip-chip package assembly
    • Patent number 11,637,083
    • Issue date Apr 25, 2023
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Textured bond pads
    • Patent number 11,600,583
    • Issue date Mar 7, 2023
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Solder-metal-solder stack for electronic interconnect
    • Patent number 11,239,190
    • Issue date Feb 1, 2022
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Methods for bump planarity control
    • Patent number 11,145,612
    • Issue date Oct 12, 2021
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Textured bond pads
    • Patent number 11,081,456
    • Issue date Aug 3, 2021
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip chip integrated circuit packages with spacers
    • Patent number 10,593,640
    • Issue date Mar 17, 2020
    • Texas Instruments Incorporated
    • James Raymond Maliclic Baello
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ALLOY FOR METAL UNDERCUT REDUCTION
    • Publication number 20240290735
    • Publication date Aug 29, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • RAFAEL JOSE GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS
    • Publication number 20240258251
    • Publication date Aug 1, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Katleen Fajardo TIMBOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS
    • Publication number 20240234356
    • Publication date Jul 11, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT HAVING EXPOSED LEADS
    • Publication number 20240203919
    • Publication date Jun 20, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo Cruz Molina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THI...
    • Publication number 20240178166
    • Publication date May 30, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP PACKAGE ASSEMBLY
    • Publication number 20240153903
    • Publication date May 9, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Katleen Fajardo Timbol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES
    • Publication number 20240128204
    • Publication date Apr 18, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Christlyn Faith Hobrero Arias
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES WITH CAVITIES AND METHODS OF MAKING THEREOF
    • Publication number 20240038608
    • Publication date Feb 1, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose L. Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP PACKAGE ASSEMBLY
    • Publication number 20230317658
    • Publication date Oct 5, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE MEMBER CAVITIES
    • Publication number 20230307327
    • Publication date Sep 28, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
    • Publication number 20230299031
    • Publication date Sep 21, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
    • Publication number 20230268302
    • Publication date Aug 24, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flip-Chip Package Assembly
    • Publication number 20230260958
    • Publication date Aug 17, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRAL REDISTRIBUTION LAYER FOR WCSP
    • Publication number 20230154813
    • Publication date May 18, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH PASSIVATED MAGNETIC CONCENTRATOR
    • Publication number 20230135922
    • Publication date May 4, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTAC...
    • Publication number 20230137996
    • Publication date May 4, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Christlyn Faith Arias
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES
    • Publication number 20230139898
    • Publication date May 4, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Christlyn Faith Hobrero Arias
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP PACKAGE ASSEMBLY
    • Publication number 20230137852
    • Publication date May 4, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Steffany Ann Lacierda Moreno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC PACKAGE WITH INTERFACE REGION
    • Publication number 20230129699
    • Publication date Apr 27, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL
    • Publication number 20230106976
    • Publication date Apr 6, 2023
    • Texas Instruments Incorporated
    • John Carlo Cruz Molina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP PACKAGE ASSEMBLY
    • Publication number 20230104156
    • Publication date Apr 6, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Katleen Fajardo Timbol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
    • Publication number 20220396474
    • Publication date Dec 15, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Flip-Chip Package Assembly
    • Publication number 20220320038
    • Publication date Oct 6, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE MEMBER CAVITIES
    • Publication number 20220319961
    • Publication date Oct 6, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Textured Bond Pads
    • Publication number 20210320074
    • Publication date Oct 14, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER-METAL-SOLDER STACK FOR ELECTRONIC INTERCONNECT
    • Publication number 20210217718
    • Publication date Jul 15, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares Guevara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
    • Publication number 20210134750
    • Publication date May 6, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Christopher Daniel MANACK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TEXTURED BOND PADS
    • Publication number 20210066220
    • Publication date Mar 4, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP INTEGRATED CIRCUIT PACKAGES WITH SPACERS
    • Publication number 20190326245
    • Publication date Oct 24, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • James Raymond Maliclic Baello
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP PLANARITY CONTROL
    • Publication number 20190206820
    • Publication date Jul 4, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS