Rahul N. Manepalli

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 12,300,620
- Issue date May 13, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive vias for electronic substrates
- Patent number 12,243,825
- Issue date Mar 4, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested interposer with through-silicon via bridge die
- Patent number 12,218,040
- Issue date Feb 4, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-to-metal adhesion promotion material
- Patent number 12,159,825
- Issue date Dec 3, 2024
- Intel Corporation
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,125,793
- Issue date Oct 22, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,087,695
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...
- Patent number 12,068,172
- Issue date Aug 20, 2024
- Intel Corporation
- Tarek A. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,990,427
- Issue date May 21, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core patch with in situ fabricated fan-out layer to enable di...
- Patent number 11,978,685
- Issue date May 7, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,973,041
- Issue date Apr 30, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture to manage FLI bump height delta and reliability needs...
- Patent number 11,955,448
- Issue date Apr 9, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,935,805
- Issue date Mar 19, 2024
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,923,307
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 11,901,248
- Issue date Feb 13, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch accommodating embedded dies having different thicknesses
- Patent number 11,862,619
- Issue date Jan 2, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered adhesion promotion films
- Patent number 11,810,859
- Issue date Nov 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 11,798,887
- Issue date Oct 24, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 11,791,269
- Issue date Oct 17, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,769,735
- Issue date Sep 26, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 11,756,890
- Issue date Sep 12, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fine line spacing architecture for bump pitch scaling
- Patent number 11,694,898
- Issue date Jul 4, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,664,290
- Issue date May 30, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Customizable release layers to enable low warpage architectures for...
- Patent number 11,658,055
- Issue date May 23, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package assemblies having foam structures for warpage control
- Patent number 11,646,274
- Issue date May 9, 2023
- Intel Corporation
- Mufei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded embedded bridge including routing layers for enhanced EMIB a...
- Patent number 11,600,563
- Issue date Mar 7, 2023
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filler material in conductive material that functions as...
- Patent number 11,527,484
- Issue date Dec 13, 2022
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
- Publication number 20250118647
- Publication date Apr 10, 2025
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...
- Publication number 20250112138
- Publication date Apr 3, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Publication number 20250107112
- Publication date Mar 27, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES
- Publication number 20250054823
- Publication date Feb 13, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20250038114
- Publication date Jan 30, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20250015003
- Publication date Jan 9, 2025
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...
- Publication number 20250006646
- Publication date Jan 2, 2025
- Intel Corporation
- Xing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...
- Publication number 20240321657
- Publication date Sep 26, 2024
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS
- Publication number 20240250043
- Publication date Jul 25, 2024
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20240243088
- Publication date Jul 18, 2024
- Intel Corporation
- Brandon C. MARIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DI...
- Publication number 20240234225
- Publication date Jul 11, 2024
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
- Publication number 20240222295
- Publication date Jul 4, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
- Publication number 20240222257
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
- Publication number 20240213156
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
- Publication number 20240213132
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED CO...
- Publication number 20240213111
- Publication date Jun 27, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE
- Publication number 20240194608
- Publication date Jun 13, 2024
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGE SUBSTRATE
- Publication number 20240188222
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20240186202
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
- Publication number 20240128138
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
- Publication number 20240113087
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
- Publication number 20240096809
- Publication date Mar 21, 2024
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES
- Publication number 20240088121
- Publication date Mar 14, 2024
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED BAFFLES ON GLASS EDGE FOR CAVITATION PROTECTION
- Publication number 20240063069
- Publication date Feb 22, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON...
- Publication number 20240055345
- Publication date Feb 15, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS

Rahul N. Manepalli

Person

Patents Grantslast 30 patents

Chiplet first architecture for die tiling applications

Inorganic-based embedded-die layers for modular semiconductive devices

Hybrid conductive vias for electronic substrates

Nested interposer with through-silicon via bridge die

Dielectric-to-metal adhesion promotion material

Electrical interconnect bridge

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Embedded die microelectronic device with molded component

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...

Chiplet first architecture for die tiling applications

Glass core patch with in situ fabricated fan-out layer to enable di...

Chiplet first architecture for die tiling applications

Architecture to manage FLI bump height delta and reliability needs...

Package with underfill containment barrier

Microelectronic structures including bridges

Patternable die attach materials and processes for patterning

Embedded die architecture and method of making

Patch accommodating embedded dies having different thicknesses

Multi-layered adhesion promotion films

Inorganic-based embedded-die layers for modular semiconductive devices

Electrical interconnect bridge

Chiplet first architecture for die tiling applications

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Hybrid fine line spacing architecture for bump pitch scaling

Package with underfill containment barrier

Customizable release layers to enable low warpage architectures for...

Multi-package assemblies having foam structures for warpage control

Molded embedded bridge including routing layers for enhanced EMIB a...

Dielectric filler material in conductive material that functions as...

Patents Applicationslast 30 patents

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...

INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES

METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES

ELECTRICAL INTERCONNECT BRIDGE

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER

PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...

CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DI...

STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...

GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED CO...

LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE

METHOD OF FORMING A PACKAGE SUBSTRATE

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...

MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...

PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

ANGLED BAFFLES ON GLASS EDGE FOR CAVITATION PROTECTION

ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON...