Rainer Florian Schnabel

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy patterns for aluminum chemical polishing (CMP)
- Patent number 6,344,409
- Issue date Feb 5, 2002
- International Business Machines Corporation
- Mark A. Jaso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slotted damascene lines for low resistive wiring lines for integrat...
- Patent number 6,265,308
- Issue date Jul 24, 2001
- International Business Machines Corporation
- Gary B. Bronner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned formation and method for semiconductors
- Patent number 6,165,896
- Issue date Dec 26, 2000
- Siemens Aktiengesellschaft
- Rainer F. Schnabel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and methods for optically measuring dielectric thickness in...
- Patent number 6,166,819
- Issue date Dec 26, 2000
- Siemens Aktiengesellschaft
- Rainer Florian Schnabel
- G01 - MEASURING TESTING
Information Patent Grant
Dummy patterns for aluminum chemical polishing (CMP)
- Patent number 6,093,631
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Mark A. Jaso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a conductive fuse and process for...
- Patent number 6,037,648
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Kenneth C. Arndt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene with bond pads
- Patent number 6,033,984
- Issue date Mar 7, 2000
- Siemens Aktiengesellschaft
- Rainer Florian Schnabel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting under-etched vias
- Patent number 5,903,343
- Issue date May 11, 1999
- Siemens Aktiengesellschaft
- Xian J. Ning
- B82 - NANO-TECHNOLOGY

Rainer Florian Schnabel

Person

Patents Grantslast 30 patents

Dummy patterns for aluminum chemical polishing (CMP)

Slotted damascene lines for low resistive wiring lines for integrat...

Self-aligned formation and method for semiconductors

System and methods for optically measuring dielectric thickness in...

Dummy patterns for aluminum chemical polishing (CMP)

Semiconductor structure including a conductive fuse and process for...

Dual damascene with bond pads

Method for detecting under-etched vias