Rainer Frauwallner

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Tragoss, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling profile integration for embedded power systems
- Patent number 11,523,496
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Frauwallner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder-free component carrier connection using an elastic element a...
- Patent number 11,264,737
- Issue date Mar 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Vockenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with integrated inductor and manufacturing method
- Patent number 11,051,406
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Frauwallner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20220190464
- Publication date Jun 16, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder-Free Component Carrier Connection Using an Elastic Element a...
- Publication number 20220158366
- Publication date May 19, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Vockenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Profile Integration for Embedded Power Systems
- Publication number 20210267044
- Publication date Aug 26, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Frauwallner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder-Free Component Carrier Connection Using an Elastic Element a...
- Publication number 20200295474
- Publication date Sep 17, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Vockenberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Integrated Inductor and Manufacturing Method
- Publication number 20190394878
- Publication date Dec 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Frauwallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20190110366
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Rainer Frauwallner

Person

Patents Grantslast 30 patents

Cooling profile integration for embedded power systems

Solder-free component carrier connection using an elastic element a...

Component carrier with integrated inductor and manufacturing method

Patents Applicationslast 30 patents

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

Solder-Free Component Carrier Connection Using an Elastic Element a...

Cooling Profile Integration for Embedded Power Systems

Solder-Free Component Carrier Connection Using an Elastic Element a...

Component Carrier With Integrated Inductor and Manufacturing Method

Component Carrier Having at Least a Part Formed as a Three-Dimensio...