Membership
Tour
Register
Log in
RAJA SWAMINATHAN
Follow
Person
AUSTIN, TX, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
3D semiconductor package with die-mounted voltage regulator
Patent number
12,165,981
Issue date
Dec 10, 2024
Advanced Micro Devices, Inc.
Gabriel H Loh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low temperature hybrid bonding
Patent number
11,911,839
Issue date
Feb 27, 2024
Advanced Micro Devices, Inc.
Priyal Shah
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Creating interconnects between dies using a cross-over die and thro...
Patent number
11,830,817
Issue date
Nov 28, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fanout module integrating a photonic integrated circuit
Patent number
11,709,327
Issue date
Jul 25, 2023
Advanced Micro Devices, Inc.
Brett P. Wilkerson
G02 - OPTICS
Patents Applications
last 30 patents
Information
Patent Application
CHIP COMPLEX WITH EMBEDDED INTERPOSER
Publication number
20240404897
Publication date
Dec 5, 2024
ADVANCED MICRO DEVICES, INC.
Deepak Vasant KULKARNI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH A GLASS INTERPOSER
Publication number
20240371714
Publication date
Nov 7, 2024
ADVANCED MICRO DEVICES, INC.
Deepak Vasant KULKARNI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES
Publication number
20240324248
Publication date
Sep 26, 2024
ADVANCED MICRO DEVICES, INC.
John Wuu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY
Publication number
20240321668
Publication date
Sep 26, 2024
ADVANCED MICRO DEVICES, INC.
Thomas D. Burd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE POWER
Publication number
20240321702
Publication date
Sep 26, 2024
ADVANCED MICRO DEVICES, INC.
Yan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY AWARE STACKING TOPOLOGY
Publication number
20240321827
Publication date
Sep 26, 2024
ADVANCED MICRO DEVICES, INC.
Omar Zia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
Publication number
20240234304
Publication date
Jul 11, 2024
ADVANCED MICRO DEVICES, INC.
Deepak Vasant KULKARNI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFAC...
Publication number
20240113004
Publication date
Apr 4, 2024
ADVANCED MICRO DEVICES, INC.
GABRIEL H. LOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...
Publication number
20240113070
Publication date
Apr 4, 2024
ADVANCED MICRO DEVICES, INC.
CHINTAN BUCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...
Publication number
20240071940
Publication date
Feb 29, 2024
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PARTITIONING WAFER PROCESSING AND HYBRID BONDING OF LAYERS FORMED O...
Publication number
20240071985
Publication date
Feb 29, 2024
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING SEMICONDCUTOR DEVICE ASSEMBLY COMPONENTS USING INTERCONN...
Publication number
20240071903
Publication date
Feb 29, 2024
ADVANCED MICRO DEVICES, INC.
GABRIEL H. LOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORGANIC PACKAGE CORE FOR A SUBSTRATE WITH HIGH DENSITY PLATED HOLES
Publication number
20240047229
Publication date
Feb 8, 2024
ADVANCED MICRO DEVICES, INC.
SRI RANGA SAI BOYAPATI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY
Publication number
20240047228
Publication date
Feb 8, 2024
ADVANCED MICRO DEVICES, INC.
Sri Ranga Sai Boyapati
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
Publication number
20240019649
Publication date
Jan 18, 2024
ADVANCED MICRO DEVICES, INC.
BRETT P. WILKERSON
G02 - OPTICS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
Publication number
20230307405
Publication date
Sep 28, 2023
ADVANCED MICRO DEVICES, INC.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERE...
Publication number
20230268319
Publication date
Aug 24, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH AN EMBEDDED ACTIVE DEVICE
Publication number
20230207544
Publication date
Jun 29, 2023
ADVANCED MICRO DEVICES, INC.
Gabriel H. Loh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE HYBRID BONDING
Publication number
20230201952
Publication date
Jun 29, 2023
ADVANCED MICRO DEVICES, INC.
PRIYAL SHAH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR CHIP DEVICE INTEGRATING THERMAL PIPES IN THREE-DIMENS...
Publication number
20230197563
Publication date
Jun 22, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
Publication number
20230197619
Publication date
Jun 22, 2023
ADVANCED MICRO DEVICES, INC.
Gabriel H LOH
G05 - CONTROLLING REGULATING
Information
Patent Application
ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT...
Publication number
20230197623
Publication date
Jun 22, 2023
ADVANCED MICRO DEVICES, INC.
Arsalan Alam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE HAVING A STACKED PASSIVE DE...
Publication number
20230130354
Publication date
Apr 27, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH ANNULAR PACKAGE LID STRUCTURE
Publication number
20230093924
Publication date
Mar 30, 2023
Priyal Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE
Publication number
20230069294
Publication date
Mar 2, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
Publication number
20220342165
Publication date
Oct 27, 2022
ADVANCED MICRO DEVICES, INC.
BRETT P. WILKERSON
G02 - OPTICS
Information
Patent Application
MULTI-LEVEL BRIDGE INTERCONNECTS
Publication number
20220208712
Publication date
Jun 30, 2022
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURAL THERMAL INTERFACING FOR LIDDED SEMICONDUCTOR PACKAGES
Publication number
20220199429
Publication date
Jun 23, 2022
ADVANCED MICRO DEVICES, INC.
PRIYAL SHAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...
Publication number
20220051985
Publication date
Feb 17, 2022
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIXED DENSITY INTERCONNECT ARCHITECTURES USING HYBRID FAN-OUT
Publication number
20220051989
Publication date
Feb 17, 2022
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS