Rajen M. Murugan

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a power converter module connected to con...
- Patent number 12,266,596
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passives to facilitate mold compound flow
- Patent number 12,243,849
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Chittranjan Mohan Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for isolation dies
- Patent number 12,243,911
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package including antenna horn and semicondu...
- Patent number 12,224,480
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 12,218,036
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shunt and patterned metal trace
- Patent number 12,211,800
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel gate driver package with grounded shield metal
- Patent number 12,191,259
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly
- Patent number 12,148,556
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-on-package including multiple types of antenna
- Patent number 12,113,293
- Issue date Oct 8, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency ceramic packages with modified castellation and meta...
- Patent number 12,040,265
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,978,709
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device multilevel package substrate for improved electro...
- Patent number 11,978,699
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,901,271
- Issue date Feb 13, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor package seal rings
- Patent number 11,881,460
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package including antenna and semiconductor...
- Patent number 11,837,775
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal layer in power packages
- Patent number 11,784,114
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer package substrate with stress buffer
- Patent number 11,784,113
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple exposed pads
- Patent number 11,735,506
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 11,621,232
- Issue date Apr 4, 2023
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-on-package including multiple types of antenna
- Patent number 11,600,932
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device and multilevel lead frame coupler
- Patent number 11,600,581
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 11,600,555
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor package seal rings
- Patent number 11,587,891
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 11,557,722
- Issue date Jan 17, 2023
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,545,420
- Issue date Jan 3, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,362,047
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 10,892,405
- Issue date Jan 12, 2021
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 10,475,786
- Issue date Nov 12, 2019
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20250140708
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES
- Publication number 20250126813
- Publication date Apr 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester ANKAMAH-KUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE
- Publication number 20250112126
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION
- Publication number 20250006660
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yutaka Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
- Publication number 20250006661
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240429216
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH PATCH ANTENNA IN PACKAGING SUBSTRATE
- Publication number 20240313404
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Harshpreet Singh Phull BAKSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20240297109
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT MODULE
- Publication number 20240297112
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH ANTENNA WAVEGUIDE
- Publication number 20240258704
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL S...
- Publication number 20240213185
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aditya Nitin Jogalekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slot Bow-Tie Antenna On Package
- Publication number 20240178163
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD
- Publication number 20240178155
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...
- Publication number 20240178154
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...
- Publication number 20240120297
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER
- Publication number 20240112997
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...
- Publication number 20240113413
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
- Publication number 20240113050
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Juan Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH INTEGRATED...
- Publication number 20240105647
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATES
- Publication number 20240071959
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Harshpreet Singh Phull BAKSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
- Publication number 20240072025
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen M. Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE STRUCTURE FOR IMPROVED CURRENT DENSITY IN HR DEVICES
- Publication number 20240063118
- Publication date Feb 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- William Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUMP-FUSING AND TAILORED PCB SYSTEM FOR LOOP INDUCTANCE REDUCTION
- Publication number 20240047316
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20240047330
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION
- Publication number 20240021971
- Publication date Jan 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aditya Nitin Jogalekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ANTENNAS IN PACKAGES
- Publication number 20240021973
- Publication date Jan 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Harshpreet Singh Phull BAKSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetic Package Cooling Using Silver Tubes with Getter Absorption...
- Publication number 20240006267
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Rajen M. Murugan

Person

Patents Grantslast 30 patents

Semiconductor device with a power converter module connected to con...

Passives to facilitate mold compound flow

Integrated circuit package for isolation dies

Microelectronic device package including antenna horn and semicondu...

Package substrate having integrated passive device(s) between leads

Semiconductor package with shunt and patterned metal trace

Multi-channel gate driver package with grounded shield metal

Semiconductor package with electromagnetic interference shielding

Integrated magnetic assembly

Antenna-on-package including multiple types of antenna

High-frequency ceramic packages with modified castellation and meta...

Integrated system-in-package with radiation shielding

Electronic device multilevel package substrate for improved electro...

Packaged semiconductor device

High current packages with reduced solder layer count

Ceramic semiconductor package seal rings

Microelectronic device package including antenna and semiconductor...

Plated metal layer in power packages

Multilayer package substrate with stress buffer

Packages with multiple exposed pads

Semiconductor package with electromagnetic interference shielding

Antenna-on-package including multiple types of antenna

Packaged electronic device and multilevel lead frame coupler

Package substrate having integrated passive device(s) between leads

Ceramic semiconductor package seal rings

Hall-effect sensor package with added current path

High current packages with reduced solder layer count

Integrated system-in-package with radiation shielding

Hall-effect sensor package with added current path

Packaged semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES

WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE

METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION

MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...

EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH PATCH ANTENNA IN PACKAGING SUBSTRATE

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

PASSIVE COMPONENT MODULE

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

MICROELECTRONIC PACKAGE WITH ANTENNA WAVEGUIDE

SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL S...

Slot Bow-Tie Antenna On Package

MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD

ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...

HYBRID CHIP CARRIER PACKAGE

MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...

MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER

MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...

SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS

ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH INTEGRATED...

MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATES

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...

BACK END OF LINE STRUCTURE FOR IMPROVED CURRENT DENSITY IN HR DEVICES

JUMP-FUSING AND TAILORED PCB SYSTEM FOR LOOP INDUCTANCE REDUCTION

PLATED METAL LAYER IN POWER PACKAGES

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION

PATCH ANTENNAS IN PACKAGES

Hermetic Package Cooling Using Silver Tubes with Getter Absorption...