Rajen S. Sidhu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming ultra thin package structures including low temp...
- Patent number 9,461,014
- Issue date Oct 4, 2016
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of adding dopants to conductive interconnect structures in...
- Patent number 9,394,619
- Issue date Jul 19, 2016
- Intel Corporation
- Rajen S. Sidhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flux materials for heated solder placement and associated technique...
- Patent number 9,283,641
- Issue date Mar 15, 2016
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-solder techniques and configurations for integrated circuit p...
- Patent number 9,257,405
- Issue date Feb 9, 2016
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming ultra thin package structures including low temp...
- Patent number 9,064,971
- Issue date Jun 23, 2015
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional material systems and processes for package-level interco...
- Patent number 9,024,453
- Issue date May 5, 2015
- Intel Corporation
- Rajen S. Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid solder and filled paste in microelectronic packaging
- Patent number 8,920,934
- Issue date Dec 30, 2014
- Intel Corporation
- Hongjin Jiang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Paste thermal interface materials
- Patent number 8,896,110
- Issue date Nov 25, 2014
- Intel Corporation
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations for surface treatment of an integrate...
- Patent number 8,895,365
- Issue date Nov 25, 2014
- Intel Corporation
- Suriyakala Ramalingam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-solder techniques and configurations for integrated circuit p...
- Patent number 8,809,181
- Issue date Aug 19, 2014
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate metallization and ball attach metallurgy with a novel dop...
- Patent number 8,701,281
- Issue date Apr 22, 2014
- Intel Corporation
- Rajen S. Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOAM COMPOSITE
- Publication number 20180005917
- Publication date Jan 4, 2018
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
- Publication number 20160260679
- Publication date Sep 8, 2016
- Intel Corporation
- Kabirkumar J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...
- Publication number 20150221609
- Publication date Aug 6, 2015
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...
- Publication number 20140319682
- Publication date Oct 30, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
- Publication number 20140291843
- Publication date Oct 2, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ADDING DOPANTS TO CONDUCTIVE INTERCONNECT STRUCTURES IN...
- Publication number 20140268534
- Publication date Sep 18, 2014
- Rajen S. Sidhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PASTE THERMAL INTERFACE MATERIALS
- Publication number 20140264820
- Publication date Sep 18, 2014
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL MATERIAL SYSTEMS AND PROCESSES FOR PACKAGE-LEVEL INTERCO...
- Publication number 20140225265
- Publication date Aug 14, 2014
- Rajen S. Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...
- Publication number 20140175644
- Publication date Jun 26, 2014
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...
- Publication number 20140175160
- Publication date Jun 26, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE/HIGH TEMPERATURE SOLDER HYBRID SOLDER INTERCONNECTS
- Publication number 20140151096
- Publication date Jun 5, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...
- Publication number 20140124925
- Publication date May 8, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX MATERIALS FOR HEATED SOLDER PLACEMENT AND ASSOCIATED TECHNIQUE...
- Publication number 20140084461
- Publication date Mar 27, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...
- Publication number 20140061902
- Publication date Mar 6, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE METALLIZATION AND BALL ATTACH METALLURGY WITH A NOVEL DOP...
- Publication number 20110147066
- Publication date Jun 23, 2011
- Rajen S. Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Rajen S. Sidhu

Person

Patents Grantslast 30 patents

Package structure to enhance yield of TMI interconnections

Hybrid low metal loading flux

Package structure to enhance yield of TMI interconnections

Methods of forming ultra thin package structures including low temp...

Methods of adding dopants to conductive interconnect structures in...

Flux materials for heated solder placement and associated technique...

Multi-solder techniques and configurations for integrated circuit p...

Methods of forming ultra thin package structures including low temp...

Functional material systems and processes for package-level interco...

Hybrid solder and filled paste in microelectronic packaging

Paste thermal interface materials

Techniques and configurations for surface treatment of an integrate...

Multi-solder techniques and configurations for integrated circuit p...

Substrate metallization and ball attach metallurgy with a novel dop...

Patents Applicationslast 30 patents

HYBRID LOW METAL LOADING FLUX

FOAM COMPOSITE

Package Structure To Enhance Yield of TMI Interconnections

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

Package Structure To Enhance Yield of TMI Interconnections

METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...

MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...

HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING

METHODS OF ADDING DOPANTS TO CONDUCTIVE INTERCONNECT STRUCTURES IN...

PASTE THERMAL INTERFACE MATERIALS

FUNCTIONAL MATERIAL SYSTEMS AND PROCESSES FOR PACKAGE-LEVEL INTERCO...

METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...

SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...

LOW TEMPERATURE/HIGH TEMPERATURE SOLDER HYBRID SOLDER INTERCONNECTS

MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...

FLUX MATERIALS FOR HEATED SOLDER PLACEMENT AND ASSOCIATED TECHNIQUE...

TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...

HYBRID LOW METAL LOADING FLUX

SUBSTRATE METALLIZATION AND BALL ATTACH METALLURGY WITH A NOVEL DOP...