Rajendra C. Dias

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic system with wire bonds
- Patent number 10,685,949
- Issue date Jun 16, 2020
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Membrane test for mechanical testing of stretchable electronics
- Patent number 10,634,594
- Issue date Apr 28, 2020
- Intel Corporation
- Ravindranth V. Mahajan
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,615,128
- Issue date Apr 7, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes multi-layer stiffener
- Patent number 10,535,615
- Issue date Jan 14, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable electronics fabrication method with strain redistributi...
- Patent number 10,468,357
- Issue date Nov 5, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 10,461,007
- Issue date Oct 29, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 10,325,866
- Issue date Jun 18, 2019
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,229,887
- Issue date Mar 12, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetically shielded electronic devices and related systems...
- Patent number 10,224,290
- Issue date Mar 5, 2019
- Intel Corporation
- Rajendra Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient encapsulant protection of devices in stretchable electronics
- Patent number 10,206,277
- Issue date Feb 12, 2019
- Intel Corporation
- Rajendra C. Dias
- A41 - WEARING APPAREL
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 10,192,810
- Issue date Jan 29, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an EMI shielding layer
- Patent number 9,991,211
- Issue date Jun 5, 2018
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 9,953,929
- Issue date Apr 24, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of connecting a first die to a second...
- Patent number 9,887,104
- Issue date Feb 6, 2018
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 9,847,304
- Issue date Dec 19, 2017
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ablation method and recipe for wafer level underfill material patte...
- Patent number 9,786,517
- Issue date Oct 10, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with corner supports
- Patent number 9,721,906
- Issue date Aug 1, 2017
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perforated conductive material for EMI shielding of semiconductor d...
- Patent number 9,704,811
- Issue date Jul 11, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an EMI shielding layer
- Patent number 9,685,413
- Issue date Jun 20, 2017
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic system with wire bonds
- Patent number 9,591,758
- Issue date Mar 7, 2017
- Intel Corporation
- Aleksandar Aleks Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die having chamfered corners
- Patent number 9,508,660
- Issue date Nov 29, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing underfill filler settling in integrated circuit...
- Patent number 9,431,274
- Issue date Aug 30, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 9,230,833
- Issue date Jan 5, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 8,999,765
- Issue date Apr 7, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optic time domain reflectometry
- Patent number 7,280,190
- Issue date Oct 9, 2007
- Intel Corporation
- Zhiyong Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20190157215
- Publication date May 23, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN S...
- Publication number 20190148268
- Publication date May 16, 2019
- Intel Corporation
- Omkar G. KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED...
- Publication number 20180366421
- Publication date Dec 20, 2018
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20180323128
- Publication date Nov 8, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20180226358
- Publication date Aug 9, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR DETECTING DEGRADATION OF A FLEXIBLE C...
- Publication number 20180089984
- Publication date Mar 29, 2018
- Intel Corporation
- Vijay Krishnan Subramanian
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES MULTI-LAYER STIFFENER
- Publication number 20180033741
- Publication date Feb 1, 2018
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE ELECTRONICS FABRICATION METHOD WITH STRAIN REDISTRIBUTI...
- Publication number 20180019213
- Publication date Jan 18, 2018
- Intel Corporation
- Rajendra C. DIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER
- Publication number 20170287851
- Publication date Oct 5, 2017
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20170287846
- Publication date Oct 5, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED EMI SHIELD
- Publication number 20170287847
- Publication date Oct 5, 2017
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral Expansion Apparatus for Mechanical Testing of Stretchable E...
- Publication number 20170268972
- Publication date Sep 21, 2017
- Intel Corporation
- Vijay Krishnan SUBRAMANIAN
- G01 - MEASURING TESTING
Information Patent Application
Inflatable Bladder Based Mechanical Testing for Stretchable Electro...
- Publication number 20170269017
- Publication date Sep 21, 2017
- Intel Corporation
- Steven A. KLEIN
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20170271270
- Publication date Sep 21, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Membrane test for Mechanical Testing of Stretchable Electronics
- Publication number 20170268971
- Publication date Sep 21, 2017
- Intel Corporation
- Ravindranth V. MAHAJAN
- G01 - MEASURING TESTING
Information Patent Application
PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...
- Publication number 20170250145
- Publication date Aug 31, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetically shielded electronic devices and related systems...
- Publication number 20170186697
- Publication date Jun 29, 2017
- Intel Corporation
- Rajendra Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device packages with conformal emi shielding and related...
- Publication number 20170186708
- Publication date Jun 29, 2017
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...
- Publication number 20170179040
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC SYSTEM WITH WIRE BONDS
- Publication number 20170179103
- Publication date Jun 22, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TRENCHED MOLDING-BASED ELECTROMAGNETIC I...
- Publication number 20170179041
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS
- Publication number 20170181275
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- A41 - WEARING APPAREL
Information Patent Application
ELECTRONIC PACKAGE WITH CORNER SUPPORTS
- Publication number 20170062356
- Publication date Mar 2, 2017
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS
- Publication number 20170018525
- Publication date Jan 19, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20160343591
- Publication date Nov 24, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE HAVING CHAMFERED CORNERS
- Publication number 20160233175
- Publication date Aug 11, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF CONNECTING A FIRST DIE TO A SECOND...
- Publication number 20160005672
- Publication date Jan 7, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC SYSTEM WITH WIRE BONDS
- Publication number 20150282321
- Publication date Oct 1, 2015
- Aleksandar Aleks Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20150179479
- Publication date Jun 25, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...
- Publication number 20150072479
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Rajendra C. Dias

Person

Patents Grantslast 30 patents

Systems and methods for electromagnetic interference shielding

Flexible electronic system with wire bonds

Membrane test for mechanical testing of stretchable electronics

Systems and methods for electromagnetic interference shielding

Electronic package that includes multi-layer stiffener

Stretchable electronics fabrication method with strain redistributi...

Semiconductor package with electromagnetic interference shielding

Electronic device packages with conformal EMI shielding and related...

Systems and methods for electromagnetic interference shielding

Electromagnetically shielded electronic devices and related systems...

Gradient encapsulant protection of devices in stretchable electronics

Underfill material flow control for reduced die-to-die spacing in s...

Semiconductor package having an EMI shielding layer

Systems and methods for electromagnetic interference shielding

Electronic package and method of connecting a first die to a second...

Electronic device packages with conformal EMI shielding and related...

Ablation method and recipe for wafer level underfill material patte...

Electronic package with corner supports

Perforated conductive material for EMI shielding of semiconductor d...

Semiconductor package having an EMI shielding layer

Flexible electronic system with wire bonds

Microelectronic die having chamfered corners

Method for reducing underfill filler settling in integrated circuit...

Methods to prevent filler entrapment in microelectronic device to m...

Methods to prevent filler entrapment in microelectronic device to m...

Electro-optic time domain reflectometry

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN S...

ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED...

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

DEVICE, SYSTEM AND METHOD FOR DETECTING DEGRADATION OF A FLEXIBLE C...

ELECTRONIC PACKAGE THAT INCLUDES MULTI-LAYER STIFFENER

STRETCHABLE ELECTRONICS FABRICATION METHOD WITH STRAIN REDISTRIBUTI...

SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED EMI SHIELD

Lateral Expansion Apparatus for Mechanical Testing of Stretchable E...

Inflatable Bladder Based Mechanical Testing for Stretchable Electro...

SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING

Membrane test for Mechanical Testing of Stretchable Electronics

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...

Electromagnetically shielded electronic devices and related systems...

Electronic device packages with conformal emi shielding and related...

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...

FLEXIBLE ELECTRONIC SYSTEM WITH WIRE BONDS

SEMICONDUCTOR PACKAGE WITH TRENCHED MOLDING-BASED ELECTROMAGNETIC I...

GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS

ELECTRONIC PACKAGE WITH CORNER SUPPORTS

METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS

REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES

MICROELECTRONIC DIE HAVING CHAMFERED CORNERS

ELECTRONIC PACKAGE AND METHOD OF CONNECTING A FIRST DIE TO A SECOND...

FLEXIBLE ELECTRONIC SYSTEM WITH WIRE BONDS

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...

ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...