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Rajendra D. Pendse
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Fremont, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Managing thermal resistance and planarity of a display package
Patent number
11,942,589
Issue date
Mar 26, 2024
Meta Platforms Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Artificial reality system having system-on-a-chip (soc) integrated...
Patent number
11,852,835
Issue date
Dec 26, 2023
Meta Platforms Technologies, LLC
Rajendra D. Pendse
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrating control circuits with light emissive circuits with diss...
Patent number
11,842,989
Issue date
Dec 12, 2023
Meta Platforms Technologies, LLC
Rajendra D. Pendse
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Artificial reality system having system-on-a-chip (SoC) integrated...
Patent number
11,550,158
Issue date
Jan 10, 2023
Meta Platforms Technologies, LLC
Rajendra D. Pendse
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated display devices
Patent number
11,545,475
Issue date
Jan 3, 2023
Meta Platforms Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Left and right projectors for display device
Patent number
11,508,700
Issue date
Nov 22, 2022
Meta Platforms Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Managing thermal resistance and planarity of a display package
Patent number
11,362,251
Issue date
Jun 14, 2022
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligning a collimator assembly with LED arrays
Patent number
11,287,656
Issue date
Mar 29, 2022
Facebook Technologies, LLC
Rajendra D. Pendse
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
Patent number
11,251,154
Issue date
Feb 15, 2022
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated display devices
Patent number
11,037,915
Issue date
Jun 15, 2021
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking of three-dimensional circuits including through-silicon-vias
Patent number
10,700,041
Issue date
Jun 30, 2020
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
Patent number
10,692,836
Issue date
Jun 23, 2020
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming high routing density int...
Patent number
10,580,749
Issue date
Mar 3, 2020
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming electrical interconnect...
Patent number
RE47600
Issue date
Sep 10, 2019
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
Information
Patent Grant
Semiconductor device and method of forming flipchip interconnect st...
Patent number
10,388,626
Issue date
Aug 20, 2019
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
Patent number
10,388,612
Issue date
Aug 20, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package (PoP) device comprising thermal interface materi...
Patent number
10,002,857
Issue date
Jun 19, 2018
QUALCOMM Incorporated
Michael James Solimando
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump-on-lead flip chip interconnection
Patent number
9,922,915
Issue date
Mar 20, 2018
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of self-confinement of conductive b...
Patent number
9,899,286
Issue date
Feb 20, 2018
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
Patent number
9,881,894
Issue date
Jan 30, 2018
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of self-confinement of conductive b...
Patent number
9,865,556
Issue date
Jan 9, 2018
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming vertical interconnect st...
Patent number
9,847,309
Issue date
Dec 19, 2017
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
Patent number
9,780,057
Issue date
Oct 3, 2017
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder joint flip chip interconnection having relief structure
Patent number
9,773,685
Issue date
Sep 26, 2017
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
Patent number
9,754,897
Issue date
Sep 5, 2017
STATS ChipPAC, Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of confining conductive bump materi...
Patent number
9,679,811
Issue date
Jun 13, 2017
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming bond-on-lead interconnec...
Patent number
9,679,824
Issue date
Jun 13, 2017
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip interconnect solder mask
Patent number
9,545,014
Issue date
Jan 10, 2017
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip interconnect solder mask
Patent number
9,545,013
Issue date
Jan 10, 2017
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming extended semiconductor d...
Patent number
9,484,319
Issue date
Nov 1, 2016
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ARTIFICIAL REALITY SYSTEM HAVING SYSTEM-ON-A-CHIP (SoC) INTEGRATED...
Publication number
20230094261
Publication date
Mar 30, 2023
Meta Platforms Technologies, LLC
Rajendra D. Pendse
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LEFT AND RIGHT PROJECTORS FOR DISPLAY DEVICE
Publication number
20230034214
Publication date
Feb 2, 2023
Meta Platforms Technologies, LLC
Rajendra D. PENDSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAMERA MODULE WITH COMPONENT SIZE BASED ON IMAGE SENSOR
Publication number
20220407987
Publication date
Dec 22, 2022
Meta Platforms Technologies, LLC
Chao Han
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
SEMICONDUCTOR RECONSTITUTION
Publication number
20220328740
Publication date
Oct 13, 2022
Facebook Technologies, LLC
Rajendra D. PENDSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANAGING THERMAL RESISTANCE AND PLANARITY OF A DISPLAY PACKAGE
Publication number
20220285601
Publication date
Sep 8, 2022
Facebook Technologies, LLC
Rajendra D. PENDSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNING A COLLIMATOR ASSEMBLY WITH LED ARRAYS
Publication number
20220229301
Publication date
Jul 21, 2022
Facebook Technologies, LLC
Rajendra D. PENDSE
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
ARTIFICIAL REALITY SYSTEM HAVING SYSTEM-ON-A-CHIP (SoC) INTEGRATED...
Publication number
20210405382
Publication date
Dec 30, 2021
Facebook Technologies, LLC
Rajendra D. PENDSE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATED DISPLAY DEVICES
Publication number
20210335767
Publication date
Oct 28, 2021
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATING CONTROL CIRCUITS WITH LIGHT EMISSIVE CIRCUITS WITH DISS...
Publication number
20210288036
Publication date
Sep 16, 2021
Facebook Technologies, LLC
Rajendra D. PENDSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATING CONTROL CIRCUITS WITH LIGHT EMISSIVE CIRCUITS WITH DISS...
Publication number
20210288032
Publication date
Sep 16, 2021
Facebook Technologies, LLC
Rajendra D. PENDSE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LEFT AND RIGHT PROJECTORS FOR DISPLAY DEVICE
Publication number
20210175216
Publication date
Jun 10, 2021
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNING A COLLIMATOR ASSEMBLY WITH LED ARRAYS
Publication number
20210165318
Publication date
Jun 3, 2021
Facebook Technologies, LLC
Rajendra D. PENDSE
G02 - OPTICS
Information
Patent Application
MANAGING THERMAL RESISTANCE AND PLANARITY OF A DISPLAY PACKAGE
Publication number
20210167268
Publication date
Jun 3, 2021
Facebook Technologies, LLC
Rajendra D. PENDSE
G02 - OPTICS
Information
Patent Application
REDUCING THE PLANARITY VARIATION IN A DISPLAY DEVICE
Publication number
20210013099
Publication date
Jan 14, 2021
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application...
Publication number
20200279827
Publication date
Sep 3, 2020
STATS ChipPAC Pte Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DISPLAY DEVICES
Publication number
20200266180
Publication date
Aug 20, 2020
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKING OF THREE-DIMENSIONAL CIRCUITS INCLUDING THROUGH-SILICON-VIAS
Publication number
20200098729
Publication date
Mar 26, 2020
Facebook Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application...
Publication number
20180096963
Publication date
Apr 5, 2018
STATS ChipPAC Pte Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
Publication number
20170330840
Publication date
Nov 16, 2017
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERI...
Publication number
20170294422
Publication date
Oct 12, 2017
QUALCOMM Incorporated
Michael James Solimando
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR...
Publication number
20170271175
Publication date
Sep 21, 2017
QUALCOMM Incorporated
Christopher James HEALY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Embedded Die
Publication number
20160284619
Publication date
Sep 29, 2016
STATS ChipPAC Pte Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Self-Confinement of Conductive B...
Publication number
20160260646
Publication date
Sep 8, 2016
STATS ChipPAC Pte Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Self-Confinement of Conductive B...
Publication number
20160071813
Publication date
Mar 10, 2016
STATS ChipPAC, Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
Publication number
20150348936
Publication date
Dec 3, 2015
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...
Publication number
20150311172
Publication date
Oct 29, 2015
STATS ChipPAC, Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Self-Confinement of Conductive B...
Publication number
20150214182
Publication date
Jul 30, 2015
STATS ChipPAC, Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Wire Bondable Fan-Out EW...
Publication number
20150140736
Publication date
May 21, 2015
STATS ChipPAC, Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
Publication number
20150054167
Publication date
Feb 26, 2015
STATS ChipPAC, Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
Publication number
20140319692
Publication date
Oct 30, 2014
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS