Rajesh Vaddi

Person

Corning, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for reducing via formation impact on electronic...
- Patent number 12,046,481
- Issue date Jul 23, 2024
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming thin film transistors on a glass substrate and...
- Patent number 12,013,619
- Issue date Jun 18, 2024
- Corning Incorporated
- Ming-Huang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bezel-free display tile with edge-wrapped conductors and methods of...
- Patent number 11,777,067
- Issue date Oct 3, 2023
- Corning Incorporated
- Jiangwei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a glass article to provide increased bondin...
- Patent number 11,756,847
- Issue date Sep 12, 2023
- Corning Incorporated
- Kaveh Adib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through glass via fabrication using a protective material
- Patent number 11,654,657
- Issue date May 23, 2023
- Corning Incorporated
- Robert George Manley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a glass article to provide increased bondin...
- Patent number 11,456,225
- Issue date Sep 27, 2022
- Corning Incorporated
- Kaveh Adib
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polar elastomer microstructures and methods for fabricating same
- Patent number 11,329,228
- Issue date May 10, 2022
- Corning Incorporated
- Robert George Manley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bezel-free display tile with edge-wrapped conductors and methods of...
- Patent number 11,282,994
- Issue date Mar 22, 2022
- Corning Incorporated
- Jiangwei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly substrates and methods for making such
- Patent number 11,257,728
- Issue date Feb 22, 2022
- Corning Incorporated
- Robert Alan Bellman
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom up electroplating with release layer
- Patent number 10,957,628
- Issue date Mar 23, 2021
- Corning Incorporated
- Robert Alan Bellman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for reducing substrate surface disruption durin...
- Patent number 10,424,606
- Issue date Sep 24, 2019
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...
- Publication number 20240140864
- Publication date May 2, 2024
- Corning Incorporated
- Hoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A GLASS ARTICLE TO PROVIDE INCREASED BONDIN...
- Publication number 20220399242
- Publication date Dec 15, 2022
- Corning Incorporated
- Kaveh Adib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Reducing Via Formation Impact on Electronic...
- Publication number 20220319868
- Publication date Oct 6, 2022
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SHEETS WITH COPPER FILMS AND METHODS OF MAKING THE SAME
- Publication number 20220212981
- Publication date Jul 7, 2022
- Corning Incorporated
- Ming-Huang Huang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
BEZEL-FREE DISPLAY TILE WITH EDGE-WRAPPED CONDUCTORS AND METHODS OF...
- Publication number 20220209087
- Publication date Jun 30, 2022
- Corning Incorporated
- JIANGWEI FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEZEL-FREE DISPLAY TILE WITH EDGE-WRAPPED CONDUCTORS AND METHODS OF...
- Publication number 20220173296
- Publication date Jun 2, 2022
- Corning Incorporated
- JIANGWEI FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
- Publication number 20210407896
- Publication date Dec 30, 2021
- Corning Incorporated
- Mandakini Kanungo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING VIAS AND METHOD AND MATERIAL FOR FABRICATING VIAS
- Publication number 20210359185
- Publication date Nov 18, 2021
- Corning Incorporated
- Sean Matthew Garner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A GLASS ARTICLE TO PROVIDE INCREASED BONDIN...
- Publication number 20210320041
- Publication date Oct 14, 2021
- Corning Incorporated
- Kaveh Adib
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH GLASS VIA FABRICATION USING A PROTECTIVE MATERIAL
- Publication number 20210187910
- Publication date Jun 24, 2021
- Corning Incorporated
- Robert George Manley
- B32 - LAYERED PRODUCTS
Information Patent Application
POLAR ELASTOMER MICROSTRUCTURES AND METHODS FOR FABRICATING SAME
- Publication number 20210135114
- Publication date May 6, 2021
- Corning Incorporated
- Robert George Manley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADHERING COPPER INTERCONNECTS IN A DISPLAY...
- Publication number 20210114923
- Publication date Apr 22, 2021
- Corning Incorporated
- MING-HUANG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING THIN FILM TRANSISTORS ON A GLASS SUBSTRATE AND...
- Publication number 20210018780
- Publication date Jan 21, 2021
- Corning Incorporated
- Ming-Huang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEZEL-FREE DISPLAY TILE WITH EDGE-WRAPPED CONDUCTORS AND METHODS OF...
- Publication number 20200243738
- Publication date Jul 30, 2020
- Corning Incorporated
- JIANGWEI FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MANGANESE OXIDE ADHESION LAYER
- Publication number 20200227277
- Publication date Jul 16, 2020
- Corning Incorporated
- Philip Simon Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUIDIC ASSEMBLY SUBSTRATES AND METHODS FOR MAKING SUCH
- Publication number 20200194323
- Publication date Jun 18, 2020
- Corning Incorporated
- Robert Alan Bellman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
- Publication number 20200165160
- Publication date May 28, 2020
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...
- Publication number 20200148593
- Publication date May 14, 2020
- Corning Incorporated
- Hoon Kim
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
A SUBSTRATE WITH A POLAR ELASTOMER DIELECTRIC AND A METHOD OF COATI...
- Publication number 20200115584
- Publication date Apr 16, 2020
- Corning Incorporated
- Robert George Manley
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
BOTTOM UP ELECTROPLATING WITH RELEASE LAYER
- Publication number 20200111726
- Publication date Apr 9, 2020
- Corning Incorporated
- Robert Alan Bellman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INCREASING ADHESION BETWEEN METALLIC FILMS AND GLASS SU...
- Publication number 20200095684
- Publication date Mar 26, 2020
- Corning Incorporated
- Dana Craig Bookbinder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GLASS ARTICLE HAVING A METALLIC NANOFILM AND METHOD OF INCREASING A...
- Publication number 20190378773
- Publication date Dec 12, 2019
- Corning Incorporated
- Philip Simon Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF INCREASING ADHESION BETWEEN A CONDUCTIVE METAL AND AN OX...
- Publication number 20190363010
- Publication date Nov 28, 2019
- Corning Incorporated
- Philip Simon Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...
- Publication number 20190327840
- Publication date Oct 24, 2019
- Corning Incorporated
- Dana Craig Bookbinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
- Publication number 20190313524
- Publication date Oct 10, 2019
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING SUBSTRATE SURFACE DISRUPTION DURIN...
- Publication number 20190312067
- Publication date Oct 10, 2019
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS

Rajesh Vaddi

Person

Patents Grantslast 30 patents

Hermetic metallized via with improved reliability

Systems and methods for reducing via formation impact on electronic...

Methods for forming thin film transistors on a glass substrate and...

Bezel-free display tile with edge-wrapped conductors and methods of...

Method of manufacturing a glass article to provide increased bondin...

Through glass via fabrication using a protective material

Method of manufacturing a glass article to provide increased bondin...

Polar elastomer microstructures and methods for fabricating same

Bezel-free display tile with edge-wrapped conductors and methods of...

Fluidic assembly substrates and methods for making such

Hermetic metallized via with improved reliability

Hermetic metallized via with improved reliability

Bottom up electroplating with release layer

Systems and methods for reducing substrate surface disruption durin...

Patents Applicationslast 30 patents

3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...

METHOD OF MANUFACTURING A GLASS ARTICLE TO PROVIDE INCREASED BONDIN...

Systems and Methods for Reducing Via Formation Impact on Electronic...

GLASS SHEETS WITH COPPER FILMS AND METHODS OF MAKING THE SAME

BEZEL-FREE DISPLAY TILE WITH EDGE-WRAPPED CONDUCTORS AND METHODS OF...

BEZEL-FREE DISPLAY TILE WITH EDGE-WRAPPED CONDUCTORS AND METHODS OF...

HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY

DEVICE INCLUDING VIAS AND METHOD AND MATERIAL FOR FABRICATING VIAS

METHOD OF MANUFACTURING A GLASS ARTICLE TO PROVIDE INCREASED BONDIN...

THROUGH GLASS VIA FABRICATION USING A PROTECTIVE MATERIAL

POLAR ELASTOMER MICROSTRUCTURES AND METHODS FOR FABRICATING SAME

SYSTEMS AND METHODS FOR ADHERING COPPER INTERCONNECTS IN A DISPLAY...

METHODS FOR FORMING THIN FILM TRANSISTORS ON A GLASS SUBSTRATE AND...

BEZEL-FREE DISPLAY TILE WITH EDGE-WRAPPED CONDUCTORS AND METHODS OF...

INTERPOSER WITH MANGANESE OXIDE ADHESION LAYER

FLUIDIC ASSEMBLY SUBSTRATES AND METHODS FOR MAKING SUCH

HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY

3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...

A SUBSTRATE WITH A POLAR ELASTOMER DIELECTRIC AND A METHOD OF COATI...

BOTTOM UP ELECTROPLATING WITH RELEASE LAYER

METHODS FOR INCREASING ADHESION BETWEEN METALLIC FILMS AND GLASS SU...

GLASS ARTICLE HAVING A METALLIC NANOFILM AND METHOD OF INCREASING A...

METHODS OF INCREASING ADHESION BETWEEN A CONDUCTIVE METAL AND AN OX...

3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...

HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY

SYSTEMS AND METHODS FOR REDUCING SUBSTRATE SURFACE DISRUPTION DURIN...