Rajinder S. Rai

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder and electrically conductive adhesive based interconnection f...
- Patent number 8,592,299
- Issue date Nov 26, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining a semiconductor device/chip to a printed wiring b...
- Patent number 8,240,031
- Issue date Aug 14, 2012
- Endicott International Technologies, Inc.
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a plated microvia interconnect
- Patent number 7,328,506
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball with chemically and mechanically enhanced surface prope...
- Patent number 6,607,613
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate having plated microvia interconnects and method for formin...
- Patent number 6,492,600
- Issue date Dec 10, 2002
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced solder surface and process for chemically and mechanically...
- Patent number 6,210,547
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating coated powder materials and their use for hig...
- Patent number 6,059,952
- Issue date May 9, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for chemically and mechanically enhancing solder surface pr...
- Patent number 6,056,831
- Issue date May 2, 2000
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY DECAL AND METHOD FOR ATTACHING SAME
- Publication number 20120015532
- Publication date Jan 19, 2012
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuitized substrate and method of making same
- Publication number 20090241332
- Publication date Oct 1, 2009
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT
- Publication number 20080017410
- Publication date Jan 24, 2008
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminate having plated microvia interconnects and method for formin...
- Publication number 20030102158
- Publication date Jun 5, 2003
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball with chemically and mechanically enhanced surface prope...
- Publication number 20010012570
- Publication date Aug 9, 2001
- Frank D. Egitto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Rajinder S. Rai

Person

Patents Grantslast 30 patents

Solder and electrically conductive adhesive based interconnection f...

Method of joining a semiconductor device/chip to a printed wiring b...

Method for forming a plated microvia interconnect

Solder ball with chemically and mechanically enhanced surface prope...

Laminate having plated microvia interconnects and method for formin...

Enhanced solder surface and process for chemically and mechanically...

Method of fabricating coated powder materials and their use for hig...

Process for chemically and mechanically enhancing solder surface pr...

Patents Applicationslast 30 patents

HIGH DENSITY DECAL AND METHOD FOR ATTACHING SAME

Circuitized substrate and method of making same

METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

Laminate having plated microvia interconnects and method for formin...

Solder ball with chemically and mechanically enhanced surface prope...