Rajneesh Kumar

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,764,489
- Issue date Sep 19, 2023
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employ...
- Patent number 11,756,894
- Issue date Sep 12, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective mold placement on integrated circuit (IC) packages and me...
- Patent number 11,742,253
- Issue date Aug 29, 2023
- QUALCOMM Incorporated
- Sayok Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for shielding bent signal lines
- Patent number 11,696,390
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising passive device configured as electromagnetic int...
- Patent number 11,670,599
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising multi-directional antennas in substrates coupled...
- Patent number 11,495,873
- Issue date Nov 8, 2022
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising multi-directional antennas coupled through a flex...
- Patent number 11,399,435
- Issue date Jul 26, 2022
- QUALCOMM Incorporated
- Jaehyun Yeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna module configurations
- Patent number 11,245,175
- Issue date Feb 8, 2022
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,239,573
- Issue date Feb 1, 2022
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for arrayed partial molding of packages
- Patent number 11,211,263
- Issue date Dec 28, 2021
- QUALCOMM Incorporated
- Srikanth Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate having a via wall configured as a sh...
- Patent number 11,139,224
- Issue date Oct 5, 2021
- QUALCOMM Incorporated
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising embedded package on package (PoP) device
- Patent number 10,510,733
- Issue date Dec 17, 2019
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising embedded package on package (PoP) device
- Patent number 10,163,871
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- Rajneesh Kumar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-Package (PoP) device comprising a gap controller between...
- Patent number 9,947,642
- Issue date Apr 17, 2018
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced wafer level package comprising a core layer for reducing...
- Patent number 9,806,063
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded components and method of making...
- Patent number 9,601,435
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management integrated circuit (PMIC) integration into a proce...
- Patent number 9,536,805
- Issue date Jan 3, 2017
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, apparatus, and methods for heat dissipation
- Patent number 9,460,980
- Issue date Oct 4, 2016
- QUALCOMM Incorporated
- Sun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder on trace technology for interconnect attachment
- Patent number 9,461,008
- Issue date Oct 4, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package (PoP) integrated device comprising a plurality o...
- Patent number 9,355,898
- Issue date May 31, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra fine pitch and spacing interconnects for substrate
- Patent number 9,159,670
- Issue date Oct 13, 2015
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density package-on-package structure
- Patent number 9,105,626
- Issue date Aug 11, 2015
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra fine pitch and spacing interconnects for substrate
- Patent number 8,772,951
- Issue date Jul 8, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...
- Publication number 20230155273
- Publication date May 18, 2023
- QUALCOMM Incorporated
- Jeahyeong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA AND DEVICE CONFIGURATIONS
- Publication number 20220166127
- Publication date May 26, 2022
- QUALCOMM Incorporated
- Seong Heon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20220131281
- Publication date Apr 28, 2022
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INT...
- Publication number 20220013472
- Publication date Jan 13, 2022
- QUALCOMM Incorporated
- Jeahyeong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR SHIELDING BENT SIGNAL LINES
- Publication number 20210410274
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20210376493
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) (RFIC) PACKAGES EMPLOY...
- Publication number 20210366838
- Publication date Nov 25, 2021
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MOLD PLACEMENT ON INTEGRATED CIRCUIT (IC) PACKAGES AND ME...
- Publication number 20210351096
- Publication date Nov 11, 2021
- QUALCOMM Incorporated
- Sayok CHATTOPADHYAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS COUPLED THROUGH A FLEX...
- Publication number 20210345492
- Publication date Nov 4, 2021
- QUALCOMM Incorporated
- Jaehyun YEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...
- Publication number 20210280959
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Jeahyeong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SH...
- Publication number 20210175152
- Publication date Jun 10, 2021
- QUALCOMM Incorporated
- Chaoqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR ARRAYED PARTIAL MOLDING OF PACKAGES
- Publication number 20210151330
- Publication date May 20, 2021
- QUALCOMM Incorporated
- Srikanth KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING DISCRETE ANTENNA DEVICE
- Publication number 20210091017
- Publication date Mar 25, 2021
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE CONFIGURATIONS
- Publication number 20190103653
- Publication date Apr 4, 2019
- QUALCOMM Incorporated
- Seong Heon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
- Publication number 20190081027
- Publication date Mar 14, 2019
- QUALCOMM Incorporated
- Rajneesh Kumar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN...
- Publication number 20170098633
- Publication date Apr 6, 2017
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
- Publication number 20170098634
- Publication date Apr 6, 2017
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...
- Publication number 20160322332
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, APPARATUS, AND METHODS FOR HEAT DISSIPATION
- Publication number 20160240455
- Publication date Aug 18, 2016
- QUALCOMM Incorporated
- Sun YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...
- Publication number 20160218064
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING PHOTO SENSITIVE FILL BETWEEN A...
- Publication number 20160172299
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD OF INTERCONNECTION IN A SUBSTRATE
- Publication number 20160093567
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY O...
- Publication number 20160035622
- Publication date Feb 4, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA FINE PITCH AND SPACING INTERCONNECTS FOR SUBSTRATE
- Publication number 20150061143
- Publication date Mar 5, 2015
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Density Package-on-Package Structure
- Publication number 20140138826
- Publication date May 22, 2014
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT
- Publication number 20140048931
- Publication date Feb 20, 2014
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Rajneesh Kumar

Person

Patents Grantslast 30 patents

Sub-module L-shaped millimeter wave antenna-in-package

Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employ...

Selective mold placement on integrated circuit (IC) packages and me...

Systems for shielding bent signal lines

Package comprising passive device configured as electromagnetic int...

Device comprising multi-directional antennas in substrates coupled...

Device comprising multi-directional antennas coupled through a flex...

Antenna module configurations

Sub-module L-shaped millimeter wave antenna-in-package

Structure for arrayed partial molding of packages

Package comprising a substrate having a via wall configured as a sh...

Integrated device comprising embedded package on package (PoP) device

Integrated device comprising embedded package on package (PoP) device

Integrated device package comprising photo sensitive fill between a...

Package-on-Package (PoP) device comprising a gap controller between...

Reinforced wafer level package comprising a core layer for reducing...

Semiconductor package with embedded components and method of making...

Power management integrated circuit (PMIC) integration into a proce...

Systems, apparatus, and methods for heat dissipation

Solder on trace technology for interconnect attachment

Package on package (PoP) integrated device comprising a plurality o...

Ultra fine pitch and spacing interconnects for substrate

High-density package-on-package structure

Ultra fine pitch and spacing interconnects for substrate

Patents Applicationslast 30 patents

DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...

ANTENNA AND DEVICE CONFIGURATIONS

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INT...

SYSTEMS FOR SHIELDING BENT SIGNAL LINES

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) (RFIC) PACKAGES EMPLOY...

SELECTIVE MOLD PLACEMENT ON INTEGRATED CIRCUIT (IC) PACKAGES AND ME...

DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS COUPLED THROUGH A FLEX...

DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...

PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SH...

STRUCTURE FOR ARRAYED PARTIAL MOLDING OF PACKAGES

PACKAGE COMPRISING DISCRETE ANTENNA DEVICE

ANTENNA MODULE CONFIGURATIONS

INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN...

INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...

SYSTEMS, APPARATUS, AND METHODS FOR HEAT DISSIPATION

SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...

INTEGRATED DEVICE PACKAGE COMPRISING PHOTO SENSITIVE FILL BETWEEN A...

SYSTEM, APPARATUS, AND METHOD OF INTERCONNECTION IN A SUBSTRATE

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY O...

ULTRA FINE PITCH AND SPACING INTERCONNECTS FOR SUBSTRATE

High-Density Package-on-Package Structure

SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT