Ralf B. Willecke

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 7,560,377
- Issue date Jul 14, 2009
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k films
- Patent number 7,160,821
- Issue date Jan 9, 2007
- Applied Materials, Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,930,061
- Issue date Aug 16, 2005
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,869,896
- Issue date Mar 22, 2005
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low K films
- Patent number 6,806,207
- Issue date Oct 19, 2004
- Applied Materials Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,734,115
- Issue date May 11, 2004
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,660,656
- Issue date Dec 9, 2003
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low dielectric constant carbon doped silicon o...
- Patent number 6,632,735
- Issue date Oct 14, 2003
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,596,655
- Issue date Jul 22, 2003
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k films using an oxidizing plasma
- Patent number 6,593,247
- Issue date Jul 15, 2003
- Applied Materials, Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,562,690
- Issue date May 13, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,541,282
- Issue date Apr 1, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,348,725
- Issue date Feb 19, 2002
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,303,523
- Issue date Oct 16, 2001
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of depositing low k films
- Publication number 20050260864
- Publication date Nov 24, 2005
- APPLIED MATERIALS, INC.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20050191846
- Publication date Sep 1, 2005
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040082199
- Publication date Apr 29, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040038545
- Publication date Feb 26, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low K films
- Publication number 20030162410
- Publication date Aug 28, 2003
- APPLIED MATERIALS, INC.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20030064610
- Publication date Apr 3, 2003
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low dielectric constant carbon doped silicon o...
- Publication number 20030032305
- Publication date Feb 13, 2003
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20020045361
- Publication date Apr 18, 2002
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010005546
- Publication date Jun 28, 2001
- APPLIED MATERIALS, INC.
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010004479
- Publication date Jun 21, 2001
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Ralf B. Willecke

Person

Patents Grantslast 30 patents

Plasma processes for depositing low dielectric constant films

Method of depositing low k films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing low K films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing low dielectric constant carbon doped silicon o...

Plasma processes for depositing low dielectric constant films

Method of depositing low k films using an oxidizing plasma

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Patents Applicationslast 30 patents

Method of depositing low k films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing low K films

Plasma processes for depositing low dielectric constant films

Method of depositing low dielectric constant carbon doped silicon o...

Plasma processes for depositing low dielectric constant films

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS