Ralph D. Hermansen

Person

Northridge, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive of flexible epoxy resin and latent dihydrazide
- Patent number 6,723,803
- Issue date Apr 20, 2004
- Raytheon Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable, thermally-conductive adhesives for electronic assemblies
- Patent number 6,132,850
- Issue date Oct 17, 2000
- Raytheon Company
- Ralph D. Hermansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room-temperature stable, one-component, thermally-conductive, flexi...
- Patent number 6,060,539
- Issue date May 9, 2000
- Raytheon Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy-terminated prepolymer of polyepoxide and diamine with curing...
- Patent number 5,965,673
- Issue date Oct 12, 1999
- Raytheon Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive of epoxy resin, amine-terminated ban and conductive filler
- Patent number 5,929,141
- Issue date Jul 27, 1999
- Raytheon Company
- Steven E. Lau
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plateable structural adhesive for cyanate ester composites
- Patent number 5,840,829
- Issue date Nov 24, 1998
- Hughes Electronics Corporation
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plateable structural adhesive for cyanate ester composites
- Patent number 5,780,581
- Issue date Jul 14, 1998
- Hughes Aircraft Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solder joint encapsulation material
- Patent number 5,759,730
- Issue date Jun 2, 1998
- Delco Electronics Corporation
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hot melt epoxy encapsulation material
- Patent number 5,708,056
- Issue date Jan 13, 1998
- Delco Electronics Corporation
- Theresa Renee Lindley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polybutadiene urethane potting material
- Patent number 5,608,028
- Issue date Mar 4, 1997
- Delco Electronics Corp.
- Henry M. Sanftleben
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Room-temperature stable, one-component, electrically-conductive, fl...
- Patent number 5,575,956
- Issue date Nov 19, 1996
- Hughes Aircraft Company
- Ralph D. Hermansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot melt conformal coating materials
- Patent number 5,510,138
- Issue date Apr 23, 1996
- Delco Electronics Corporation
- Henry M. Sanftleben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant of amine-cured epoxy resin blends
- Patent number 5,457,165
- Issue date Oct 10, 1995
- Hughes Aircraft Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Frozen premix, fillet-holding urethane adhesives/sealants
- Patent number 5,385,966
- Issue date Jan 31, 1995
- Hughes Aircraft Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Superior thermal transfer adhesive
- Patent number 5,367,006
- Issue date Nov 22, 1994
- Hughes Aircraft Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low exotherm, low temperature curing, epoxy impregnants
- Patent number 5,350,779
- Issue date Sep 27, 1994
- Hughes Aircraft Company
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit assembly encapsulated with polybutadiene urethane
- Patent number 5,185,498
- Issue date Feb 9, 1993
- Delco Electronics Corporation
- Henry M. Sanftleben
- G01 - MEASURING TESTING
Information Patent Grant
Method of bonding metals with a radio-opaque adhesive/sealant for v...
- Patent number 4,940,633
- Issue date Jul 10, 1990
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flexible epoxy adhesive blend
- Patent number 4,866,108
- Issue date Sep 12, 1989
- Hughes Aircraft Company
- David J. Vachon
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of making an epoxy prepolymer curing agent
- Patent number 4,534,882
- Issue date Aug 13, 1985
- Hughes Aircraft Company
- Norman Bilow
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Transparent formable polyurethane polycarbonate lamination
- Patent number 4,045,269
- Issue date Aug 30, 1977
- Sierracin Corporation
- David Lehmann Voss
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Ralph D. Hermansen

Person

Patents Grantslast 30 patents

Adhesive of flexible epoxy resin and latent dihydrazide

Reworkable, thermally-conductive adhesives for electronic assemblies

Room-temperature stable, one-component, thermally-conductive, flexi...

Epoxy-terminated prepolymer of polyepoxide and diamine with curing...

Adhesive of epoxy resin, amine-terminated ban and conductive filler

Plateable structural adhesive for cyanate ester composites

Plateable structural adhesive for cyanate ester composites

Solder joint encapsulation material

Hot melt epoxy encapsulation material

Polybutadiene urethane potting material

Room-temperature stable, one-component, electrically-conductive, fl...

Hot melt conformal coating materials

Encapsulant of amine-cured epoxy resin blends

Frozen premix, fillet-holding urethane adhesives/sealants

Superior thermal transfer adhesive

Low exotherm, low temperature curing, epoxy impregnants

Circuit assembly encapsulated with polybutadiene urethane

Method of bonding metals with a radio-opaque adhesive/sealant for v...

Flexible epoxy adhesive blend

Method of making an epoxy prepolymer curing agent

Transparent formable polyurethane polycarbonate lamination