Ramakanth Alapati

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Active alignment of optical die to optical substrates
- Patent number 12,130,195
- Issue date Oct 29, 2024
- PSIQUANTUM, CORP.
- Bradley Snyder
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric liners on through glass vias
- Patent number 12,087,623
- Issue date Sep 10, 2024
- YIELD ENGINEERING SYSTEMS, INC.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,897,761
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photonic quantum computer assembly
- Patent number 11,892,693
- Issue date Feb 6, 2024
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,784,457
- Issue date Oct 10, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,742,327
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 11,670,627
- Issue date Jun 6, 2023
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- G02 - OPTICS
Information Patent Grant
Semiconductor device having a lid configured as an enclosure and a...
- Patent number 11,588,009
- Issue date Feb 21, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum computing die assembly with thru-silicon vias
- Patent number 11,550,108
- Issue date Jan 10, 2023
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photonic quantum computer assembly having dies with specific contac...
- Patent number 11,493,713
- Issue date Nov 8, 2022
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum computing die assembly with thru-silicon vias and connected...
- Patent number 11,493,714
- Issue date Nov 8, 2022
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,352,252
- Issue date Jun 7, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,133,642
- Issue date Sep 28, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 11,107,799
- Issue date Aug 31, 2021
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active alignment of optical die to optical substrates
- Patent number 11,035,752
- Issue date Jun 15, 2021
- PSIQUANTUM, CORP.
- Bradley Snyder
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,024,604
- Issue date Jun 1, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,644,479
- Issue date May 5, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for integration of TSV-middle in 3D IC stacks
- Patent number 9,553,080
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Inc.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electronic circuit assembly on a paper substrate
- Patent number 9,318,466
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Saket Chadda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via unit cell with keep out zones and center point...
- Patent number 9,123,787
- Issue date Sep 1, 2015
- GLOBALFOUNDRIES Inc.
- Himani S. Kamineni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of thinning and/or dicing semiconducting substrates having...
- Patent number 8,669,166
- Issue date Mar 11, 2014
- GLOBALFOUNDRIES Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit system with connecting via structure and meth...
- Patent number 8,637,993
- Issue date Jan 28, 2014
- GLOBALFOUNDRIES, INC.
- Chun Yu Wong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240190700
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS CHAMBER WITH UV IRRADIANCE
- Publication number 20230294190
- Publication date Sep 21, 2023
- Yield Engineering Systems, Inc.
- Tapani Laaksonen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20230197769
- Publication date Jun 22, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Ramakanth ALAPATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220298008
- Publication date Sep 22, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20210408757
- Publication date Dec 30, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ramakanth ALAPATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE ALIGNMENT OF OPTICAL DIE TO OPTICAL SUBSTRATES
- Publication number 20210270693
- Publication date Sep 2, 2021
- Psiquantum, Corp.
- Bradley Snyder
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210272934
- Publication date Sep 2, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun BOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210043606
- Publication date Feb 11, 2021
- Amkor Technology Inc.
- Shaun BOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200399119
- Publication date Dec 24, 2020
- Amkor Technology Korea, Inc.
- Ki Yeul YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200274319
- Publication date Aug 27, 2020
- Amkor Technology Singapore Holding Pte. Ltd.
- Ramakanth ALAPATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200194542
- Publication date Jun 18, 2020
- Amkor Technology, Inc.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR LOW-K FACE-TO-FACE BONDED WAFER DICING
- Publication number 20170062399
- Publication date Mar 2, 2017
- GLOBALFOUNDRIES INC.
- Luke ENGLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC DEVICES WITH THROUGH DIELECTRIC VIA INTERPOSER
- Publication number 20170054039
- Publication date Feb 23, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Shunqiang GONG
- G02 - OPTICS
Information Patent Application
ELECTRONIC CIRCUIT ASSEMBLY SUBSTRATE AND DEVICE THEREOF
- Publication number 20160165729
- Publication date Jun 9, 2016
- GLOBALFOUNDRIES INC.
- Saket CHADDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELECTRONIC CIRCUIT ASSEMBLY ON A PAPER SUBSTRATE
- Publication number 20160064354
- Publication date Mar 3, 2016
- GLOBALFOUNDRIES INC.
- Saket CHADDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA UNIT CELL AND METHODS OF USE
- Publication number 20150076706
- Publication date Mar 19, 2015
- GLOBAL FOUNDRIES Inc.
- Himani S. Kamineni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED SEMICONDUCTOR DEVICES WITH A GLASS WINDOW WAFER HAVING AN E...
- Publication number 20140070405
- Publication date Mar 13, 2014
- GLOBALFOUNDRIES INC.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF THINNING AND/OR DICING SEMICONDUCTING SUBSTRATES HAVING...
- Publication number 20140051233
- Publication date Feb 20, 2014
- GLOBALFOUNDRIES INC.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT SYSTEM WITH CONNECTING VIA STRUCTURE AND METH...
- Publication number 20130277854
- Publication date Oct 24, 2013
- GLOBALFOUNDRIES INC.
- Chun Yu Wong
- H01 - BASIC ELECTRIC ELEMENTS

Ramakanth Alapati

Person

Patents Grantslast 30 patents

Active alignment of optical die to optical substrates

Hybrid system including photonic and electronic integrated circuits...

Dielectric liners on through glass vias

Semiconductor device and method of manufacturing semiconductor device

Photonic quantum computer assembly

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor devices and methods of manufacturing semiconductor de...

Hybrid system including photonic and electronic integrated circuits...

Semiconductor device having a lid configured as an enclosure and a...

Quantum computing die assembly with thru-silicon vias

Photonic quantum computer assembly having dies with specific contac...

Quantum computing die assembly with thru-silicon vias and connected...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing a semiconductor de...

Hybrid system including photonic and electronic integrated circuits...

Active alignment of optical die to optical substrates

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device and method of manufacturing a semiconductor de...

Method and process for integration of TSV-middle in 3D IC stacks

Method for electronic circuit assembly on a paper substrate

Through-silicon via unit cell with keep out zones and center point...

Methods of thinning and/or dicing semiconducting substrates having...

3D integrated circuit system with connecting via structure and meth...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROCESS CHAMBER WITH UV IRRADIANCE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

ACTIVE ALIGNMENT OF OPTICAL DIE TO OPTICAL SUBSTRATES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

METHOD AND STRUCTURE FOR LOW-K FACE-TO-FACE BONDED WAFER DICING

PHOTONIC DEVICES WITH THROUGH DIELECTRIC VIA INTERPOSER

ELECTRONIC CIRCUIT ASSEMBLY SUBSTRATE AND DEVICE THEREOF

METHOD FOR ELECTRONIC CIRCUIT ASSEMBLY ON A PAPER SUBSTRATE

THROUGH-SILICON VIA UNIT CELL AND METHODS OF USE

STACKED SEMICONDUCTOR DEVICES WITH A GLASS WINDOW WAFER HAVING AN E...

METHODS OF THINNING AND/OR DICING SEMICONDUCTING SUBSTRATES HAVING...

3D INTEGRATED CIRCUIT SYSTEM WITH CONNECTING VIA STRUCTURE AND METH...