Randolph F. Knarr

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to recess cobalt for gate metal application
- Patent number 10,707,132
- Issue date Jul 7, 2020
- International Business Machines Corporation
- Georges Jacobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to recess cobalt for gate metal application
- Patent number 10,615,078
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Georges Jacobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to recess cobalt for gate metal application
- Patent number 10,546,785
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Georges Jacobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively etching with reduced aspect ratio dependence
- Patent number 10,541,141
- Issue date Jan 21, 2020
- Lam Research Corporation
- Adarsh Basavalingappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively etching with reduced aspect ratio dependence
- Patent number 10,037,890
- Issue date Jul 31, 2018
- Lam Research Corporation
- Adarsh Basavalingappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmentally green process and composition for cobalt wet etch
- Patent number 9,947,547
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Frank W. Mont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate MOSFET with a high performance gate electrode
- Patent number 9,337,289
- Issue date May 10, 2016
- GLOBALFOUNDRIES Inc.
- Zhengwen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate MOSFET with a high performance gate electrode
- Patent number 8,969,933
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Zhengwen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlapping contacts for semiconductor device
- Patent number 8,940,634
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate MOSFET with a high performance gate electrode
- Patent number 8,592,266
- Issue date Nov 26, 2013
- International Business Machines Corporation
- Zhengwen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for forming a self-aligned silicide contact
- Patent number 8,101,518
- Issue date Jan 24, 2012
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact metallurgy structure
- Patent number 8,089,157
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming self-aligned metal silicide contacts
- Patent number 8,039,382
- Issue date Oct 18, 2011
- International Business Machines Corporation
- Sunfei Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface cleaning using sacrificial getter layer
- Patent number 7,993,987
- Issue date Aug 9, 2011
- International Business Machines Corporation
- Randolph F. Knarr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrodeposited contacts
- Patent number 7,851,357
- Issue date Dec 14, 2010
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming self-aligned metal silicide contacts
- Patent number 7,618,891
- Issue date Nov 17, 2009
- International Business Machines Corporation
- Sunfei Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a bond pad on an I/C chip and resulting structure
- Patent number 7,572,726
- Issue date Aug 11, 2009
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for forming a self-aligned silicide contact
- Patent number 7,544,610
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper contact via structure using hybrid barrier layer
- Patent number 7,498,256
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Randolph F. Knarr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming electrodeposited contacts
- Patent number 7,405,154
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/C chip suitable for wire bonding
- Patent number 6,995,475
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for interconnect and method
- Patent number 6,992,389
- Issue date Jan 31, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low impedance power distribution structure for a semiconductor chip...
- Patent number 6,661,100
- Issue date Dec 9, 2003
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial seed layer process for forming C4 solder bumps
- Patent number 6,622,907
- Issue date Sep 23, 2003
- International Business Machines Corporation
- Lisa A. Fanti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tetra aza ligand systems as complexing agents for electroless depos...
- Patent number 5,102,456
- Issue date Apr 7, 1992
- International Business Machines Corporation
- Rangarajan Jagannathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tetra aza ligand systems as complexing agents for electroless depos...
- Patent number 5,059,243
- Issue date Oct 22, 1991
- International Business Machines Corporation
- Rangarajan Jagannathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...
- Publication number 20250096036
- Publication date Mar 20, 2025
- LAM RESEARCH CORPORATION
- Asish Parbatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-CAPPED COPPER IN DUAL DAMASCENE INTERCONNECT
- Publication number 20240213159
- Publication date Jun 27, 2024
- LAM RESEARCH CORPORATION
- Asish Parbatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO RECESS COBALT FOR GATE METAL APPLICATION
- Publication number 20190385913
- Publication date Dec 19, 2019
- International Business Machines Corporation
- Georges Jacobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO RECESS COBALT FOR GATE METAL APPLICATION
- Publication number 20190385912
- Publication date Dec 19, 2019
- International Business Machines Corporation
- Georges Jacobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE
- Publication number 20180330959
- Publication date Nov 15, 2018
- LAM RESEARCH CORPORATION
- Adarsh BASAVALINGAPPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO RECESS COBALT FOR GATE METAL APPLICATION
- Publication number 20180261507
- Publication date Sep 13, 2018
- International Business Machines Corporation
- Georges Jacobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE
- Publication number 20180102253
- Publication date Apr 12, 2018
- LAM RESEARCH CORPORATION
- Adarsh BASAVALINGAPPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTALLY GREEN PROCESS AND COMPOSITION FOR COBALT WET ETCH
- Publication number 20180005839
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Frank W. Mont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE PASSIVATION LAYERS AND METHODS OF FABRICATING
- Publication number 20160343806
- Publication date Nov 24, 2016
- GLOBALFOUNDRIES INC.
- Shariq SIDDIQUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE MOSFET WITH A HIGH PERFORMANCE GATE ELECTRODE
- Publication number 20150137269
- Publication date May 21, 2015
- International Business Machines Corporation
- Zhengwen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE
- Publication number 20130241070
- Publication date Sep 19, 2013
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE MOSFET WITH A HIGH PERFORMANCE GATE ELECTRODE
- Publication number 20130175641
- Publication date Jul 11, 2013
- International Business Machines Corporation
- Zhengwen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE
- Publication number 20130001786
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE MOSFET WITH A HIGH PERFORMANCE GATE ELECTRODE
- Publication number 20120104469
- Publication date May 3, 2012
- International Business Machines Corporation
- Zhengwen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ELECTRODEPOSITED CONTACTS
- Publication number 20110084393
- Publication date Apr 14, 2011
- International Business Machines Corporation
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SELF-ALIGNED METAL SILICIDE CONTACTS
- Publication number 20090309228
- Publication date Dec 17, 2009
- International Business Machines Corporation
- Sunfei Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICES WITH SILICON-GERMANI...
- Publication number 20090152590
- Publication date Jun 18, 2009
- International Business Machines Corporation
- Thomas N. Adam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS
- Publication number 20090014878
- Publication date Jan 15, 2009
- International Business Machines Corporation
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PROCESS FOR FORMING A SELF-ALIGNED SILICIDE CONTACT
- Publication number 20080274611
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CONTACT VIA STRUCTURE USING HYBRID BARRIER LAYER
- Publication number 20080042291
- Publication date Feb 21, 2008
- Randolph F. Knarr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming self-aligned metal silicide contacts
- Publication number 20070254479
- Publication date Nov 1, 2007
- International Business Machines Corporation
- Sunfei Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS
- Publication number 20070222066
- Publication date Sep 27, 2007
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
- Publication number 20060081981
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and process for forming a self-aligned silicide contact
- Publication number 20060051961
- Publication date Mar 9, 2006
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR INTERCONNECT AND METHOD
- Publication number 20050245070
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
- Publication number 20050062170
- Publication date Mar 24, 2005
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER
- Publication number 20050026416
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SACRIFICIAL SEED LAYER PROCESS FOR FORMING C4 SOLDER BUMPS
- Publication number 20030155408
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Lisa A. Fanti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of improving uniformity of etching of a film on an article
- Publication number 20020190028
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS

Randolph F. Knarr

Person

Patents Grantslast 30 patents

Method to recess cobalt for gate metal application

Method to recess cobalt for gate metal application

Method to recess cobalt for gate metal application

Method for selectively etching with reduced aspect ratio dependence

Method for selectively etching with reduced aspect ratio dependence

Environmentally green process and composition for cobalt wet etch

Replacement gate MOSFET with a high performance gate electrode

Replacement gate MOSFET with a high performance gate electrode

Overlapping contacts for semiconductor device

Replacement gate MOSFET with a high performance gate electrode

Method and process for forming a self-aligned silicide contact

Contact metallurgy structure

Method for forming self-aligned metal silicide contacts

Surface cleaning using sacrificial getter layer

Method of forming electrodeposited contacts

Method for forming self-aligned metal silicide contacts

Method of forming a bond pad on an I/C chip and resulting structure

Method and process for forming a self-aligned silicide contact

Copper contact via structure using hybrid barrier layer

Structure and method of forming electrodeposited contacts

I/C chip suitable for wire bonding

Barrier for interconnect and method

Low impedance power distribution structure for a semiconductor chip...

Sacrificial seed layer process for forming C4 solder bumps

Tetra aza ligand systems as complexing agents for electroless depos...

Tetra aza ligand systems as complexing agents for electroless depos...

Patents Applicationslast 30 patents

SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...

GRAPHENE-CAPPED COPPER IN DUAL DAMASCENE INTERCONNECT

METHOD TO RECESS COBALT FOR GATE METAL APPLICATION

METHOD TO RECESS COBALT FOR GATE METAL APPLICATION

METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE

METHOD TO RECESS COBALT FOR GATE METAL APPLICATION

METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE

ENVIRONMENTALLY GREEN PROCESS AND COMPOSITION FOR COBALT WET ETCH

INTERFACE PASSIVATION LAYERS AND METHODS OF FABRICATING

REPLACEMENT GATE MOSFET WITH A HIGH PERFORMANCE GATE ELECTRODE

OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE

REPLACEMENT GATE MOSFET WITH A HIGH PERFORMANCE GATE ELECTRODE

OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE

REPLACEMENT GATE MOSFET WITH A HIGH PERFORMANCE GATE ELECTRODE

METHOD OF FORMING ELECTRODEPOSITED CONTACTS

METHOD FOR FORMING SELF-ALIGNED METAL SILICIDE CONTACTS

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICES WITH SILICON-GERMANI...

STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS

METHOD AND PROCESS FOR FORMING A SELF-ALIGNED SILICIDE CONTACT

COPPER CONTACT VIA STRUCTURE USING HYBRID BARRIER LAYER

Method for forming self-aligned metal silicide contacts

STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS

Method of forming a bond pad on an I/C chip and resulting structure

Method and process for forming a self-aligned silicide contact

BARRIER FOR INTERCONNECT AND METHOD

Method of forming a bond pad on an I/C chip and resulting structure

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

SACRIFICIAL SEED LAYER PROCESS FOR FORMING C4 SOLDER BUMPS

Method of improving uniformity of etching of a film on an article