RANDY H. Y. LO

Person

TAICHUNG HSIEN, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a thin and fine ball-grid array package with...
- Patent number 7,045,395
- Issue date May 16, 2006
- Siliconware Precision Industries Co., Ltd.
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thin and fine ball-grid array package with...
- Patent number 6,951,776
- Issue date Oct 4, 2005
- Siliconware Precision Industries Co., Ltd.
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thin and fine ball-grid array package with...
- Patent number 6,949,413
- Issue date Sep 27, 2005
- Siliconware Precision Industries Co., Ltd.
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thin and fine ball-grid array package with...
- Patent number 6,949,414
- Issue date Sep 27, 2005
- Siliconware Precision Industries Co., Ltd.
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thin and fine ball-grid array package with...
- Patent number 6,933,175
- Issue date Aug 23, 2005
- Siliconware Precision Industries Co., Ltd.
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash-preventing semiconductor package
- Patent number 6,864,564
- Issue date Mar 8, 2005
- Siliconware Precision Industries, Co., Ltd.
- Chun-Chi Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging multi chip module
- Patent number 6,798,054
- Issue date Sep 28, 2004
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit probing contact pad formed on a bond pad in a flip chip pac...
- Patent number 6,753,609
- Issue date Jun 22, 2004
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a multi chip module having stacked chips
- Patent number 6,650,009
- Issue date Nov 18, 2003
- Siliconware Precision Industries Co., Ltd.
- Tzong-Dar Her
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip package structure with on-chip integration of pa...
- Patent number 6,611,434
- Issue date Aug 26, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die package structure
- Patent number 6,593,662
- Issue date Jul 15, 2003
- Siliconware Precision Industries Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple stacked-chip packaging structure
- Patent number 6,555,902
- Issue date Apr 29, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thin and fine ball-grid array package with...
- Patent number 6,541,310
- Issue date Apr 1, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package with exposed base layer
- Patent number 6,528,722
- Issue date Mar 4, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien Ping Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip packaging structure
- Patent number 6,507,098
- Issue date Jan 14, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip type quad flat non-leaded package
- Patent number 6,507,120
- Issue date Jan 14, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure stacking chips on front surface and back surface...
- Patent number 6,414,384
- Issue date Jul 2, 2002
- Silicon Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder areas over a lead frame
- Patent number 6,391,758
- Issue date May 21, 2002
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding for small clearance
- Patent number 6,321,976
- Issue date Nov 27, 2001
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a ball grid array integrated circuit package...
- Patent number 6,306,682
- Issue date Oct 23, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module package structure
- Patent number 6,281,578
- Issue date Aug 28, 2001
- Siliconware Precision Industries, Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-grid array integrated circuit package with an embedded type of...
- Patent number 6,282,094
- Issue date Aug 28, 2001
- Siliconware Precision Industries, Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of heat conducting apparatus and chip carrier in IC pac...
- Patent number 6,282,096
- Issue date Aug 28, 2001
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming circuit probing contact points on fine pitch peri...
- Patent number 6,258,705
- Issue date Jul 10, 2001
- Siliconeware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging process of semiconductor
- Patent number 6,242,283
- Issue date Jun 5, 2001
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip ball grid array package with a heat slug
- Patent number 6,166,435
- Issue date Dec 26, 2000
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating a thin and fine ball-grid array package with...
- Publication number 20030178721
- Publication date Sep 25, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a thin and fine ball-grid array package with...
- Publication number 20030162405
- Publication date Aug 28, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a thin and fine ball-grid array package with...
- Publication number 20030155647
- Publication date Aug 21, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a thin and fine ball-grid array package with...
- Publication number 20030155648
- Publication date Aug 21, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a thin and fine ball-grid array package with...
- Publication number 20030134437
- Publication date Jul 17, 2003
- Siliconware Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a multi chip module having stacked chips
- Publication number 20020180023
- Publication date Dec 5, 2002
- Tzong-Dar Her
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20020163066
- Publication date Nov 7, 2002
- Siliconware Precision Industries Co., Ltd.
- Chun-Chi Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip type quad flat non-leaded package
- Publication number 20020079592
- Publication date Jun 27, 2002
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE STACKING CHIPS ON FRONT SURFACE AND BACK SURFACE...
- Publication number 20020079567
- Publication date Jun 27, 2002
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH EXPOSED BASE LAYER
- Publication number 20020046854
- Publication date Apr 25, 2002
- CHIEN PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PROBING CONTACT PAD FORMED ON A BOND PAD IN A FLIP CHIP PAC...
- Publication number 20020031880
- Publication date Mar 14, 2002
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple stacked-chip packaging structure
- Publication number 20020014689
- Publication date Feb 7, 2002
- Randy H.Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of wire bonding for small clearance
- Publication number 20010042776
- Publication date Nov 22, 2001
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS

RANDY H. Y. LO

Person

Patents Grantslast 30 patents

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Flash-preventing semiconductor package

Method of packaging multi chip module

Circuit probing contact pad formed on a bond pad in a flip chip pac...

Structure of a multi chip module having stacked chips

Stacked multi-chip package structure with on-chip integration of pa...

Stacked-die package structure

Multiple stacked-chip packaging structure

Method of fabricating a thin and fine ball-grid array package with...

Ball grid array semiconductor package with exposed base layer

Multi-chip packaging structure

Flip chip type quad flat non-leaded package

Package structure stacking chips on front surface and back surface...

Method of forming solder areas over a lead frame

Method of wire bonding for small clearance

Method of fabricating a ball grid array integrated circuit package...

Multi-chip module package structure

Ball-grid array integrated circuit package with an embedded type of...

Integration of heat conducting apparatus and chip carrier in IC pac...

Method of forming circuit probing contact points on fine pitch peri...

Wafer level packaging process of semiconductor

Flip-chip ball grid array package with a heat slug

Patents Applicationslast 30 patents

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Method of fabricating a thin and fine ball-grid array package with...

Structure of a multi chip module having stacked chips

Semiconductor package and method for fabricating the same

Flip chip type quad flat non-leaded package

PACKAGE STRUCTURE STACKING CHIPS ON FRONT SURFACE AND BACK SURFACE...

BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH EXPOSED BASE LAYER

CIRCUIT PROBING CONTACT PAD FORMED ON A BOND PAD IN A FLIP CHIP PAC...

Multiple stacked-chip packaging structure

Method of wire bonding for small clearance