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MOLDED FLUIDIC DIE ASSEMBLIES
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Publication date Apr 6, 2023
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B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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FLUIDIC DIES WITH CONDUCTIVE MEMBERS
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Publication date Jul 29, 2021
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Hewlett-Packard Development Company, L.P.
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Michael W CUMBIE
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DRIVING A DISPLAY
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Publication date Nov 19, 2015
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GREGG COMBS
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G02 - OPTICS
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FILM STACK INCLUDING ADHESIVE LAYER
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Publication date Oct 30, 2014
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Hewlett-Packard Development Company, L.P.
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James Elmer Abbott
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B32 - LAYERED PRODUCTS
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FILM STACK INCLUDING ADHESIVE LAYER
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Publication date Oct 30, 2014
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Hewlett-Packard Development Company, L.P.
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James Elmer Abbott
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B32 - LAYERED PRODUCTS
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CONFIGURABLE SENSOR ARRAYS
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Publication date Sep 25, 2014
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Devin Alexander Mourey
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G01 - MEASURING TESTING
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THIN FILM TRANSISTORS
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Publication date Apr 18, 2013
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Oregon State University
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Chris Knutson
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H01 - BASIC ELECTRIC ELEMENTS
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MULTILAYER DIELECTRIC
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Publication date Nov 4, 2010
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Hewlett-Packard Development Company L.P.
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Gregory S. Herman
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication date Apr 1, 2010
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Hewlett-Packard Development Company, L.P.
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Randy L. Hoffman
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H01 - BASIC ELECTRIC ELEMENTS
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MULTILAYER DIELECTRIC
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Publication number 20090032890
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Publication date Feb 5, 2009
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Hewlett-Packard Development
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Gregory S. Herman
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H01 - BASIC ELECTRIC ELEMENTS
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Microelectronic device
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Publication date Feb 5, 2009
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Gregory Herman
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Semiconductor Device
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Publication date Oct 16, 2008
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Randy L. Hoffman
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device
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Publication date May 8, 2008
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Randy Hoffman
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H01 - BASIC ELECTRIC ELEMENTS
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