Rangsun Kitnarong

Person

Bangkeng Muang, TH

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a surface-mount integrated circuit package with s...
- Patent number 11,887,864
- Issue date Jan 30, 2024
- Microchip Technology Incorporated
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount integrated circuit package with coated surfaces for i...
- Patent number 11,127,660
- Issue date Sep 21, 2021
- Microchip Technology Incorporated
- Rangsun Kitnarong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-mount integrated circuit package with coated surfaces for i...
- Patent number 11,101,200
- Issue date Aug 24, 2021
- Microchip Technology Incorporated
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved adhesion between a leadframe and m...
- Patent number 10,211,131
- Issue date Feb 19, 2019
- Microchip Technology Incorporated
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...
- Publication number 20220344173
- Publication date Oct 27, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH COATED SURFACES FOR I...
- Publication number 20200211935
- Publication date Jul 2, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH COATED SURFACES FOR I...
- Publication number 20200211936
- Publication date Jul 2, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Down Bond in Semiconductor Devices
- Publication number 20190221502
- Publication date Jul 18, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Joseph Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Leads Package With Improved Contact Pins
- Publication number 20170294367
- Publication date Oct 12, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Leads Package With Improved Contact Pins
- Publication number 20170005030
- Publication date Jan 5, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEADS PACKAGE WITH IMPROVED CONTACT PINS
- Publication number 20160148876
- Publication date May 26, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE WITH IMPROVED CONTACT PINS
- Publication number 20160148877
- Publication date May 26, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Configuration to Enable Strip Testing of SOT-23 Packages...
- Publication number 20080265923
- Publication date Oct 30, 2008
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS

Rangsun Kitnarong

Person

Patents Grantslast 30 patents

Method of forming a surface-mount integrated circuit package with s...

Surface-mount integrated circuit package with coated surfaces for i...

Surface-mount integrated circuit package with coated surfaces for i...

Systems and methods for improved adhesion between a leadframe and m...

Patents Applicationslast 30 patents

METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...

SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH COATED SURFACES FOR I...

SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH COATED SURFACES FOR I...

Down Bond in Semiconductor Devices

Flat No-Leads Package With Improved Contact Pins

Flat No-Leads Package With Improved Contact Pins

FLAT NO-LEADS PACKAGE WITH IMPROVED CONTACT PINS

QFN PACKAGE WITH IMPROVED CONTACT PINS

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages...