Ranjit Gannamani

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a filled trench structure and methods f...
- Patent number 8,174,131
- Issue date May 8, 2012
- GLOBALFOUNDRIES Inc.
- Zhen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with solder joint protection ring
- Patent number 7,923,850
- Issue date Apr 12, 2011
- Advanced Micro Devices, Inc.
- Mohammad Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with stratified underfill
- Patent number 7,745,264
- Issue date Jun 29, 2010
- Advanced Micro Devices, Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a package for decapsulating a chip-...
- Patent number 6,241,907
- Issue date Jun 5, 2001
- Advanced Micro Devices, Inc.
- Ranjit Gannamani
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A FILLED TRENCH STRUCTURE AND METHODS F...
- Publication number 20100301460
- Publication date Dec 2, 2010
- GLOBALFOUNDRIES INC.
- Zhen ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Solder Joint Protection Ring
- Publication number 20100052188
- Publication date Mar 4, 2010
- Mohammad Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Interconnect
- Publication number 20100015762
- Publication date Jan 21, 2010
- Mohammad Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Stratified Underfill
- Publication number 20090057928
- Publication date Mar 5, 2009
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS