TREA

Ravi Kanth KOLAN

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  • Singapore, SG
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Patents Grantslast 30 patents

  • Information Patent Grant

    Packaging structural member
    • Patent number 9,704,726
    • Issue date Jul 11, 2017
    • UTAC HEADQUARTERS PTE. LTD.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging structural member
    • Patent number 9,142,487
    • Issue date Sep 22, 2015
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interposer for semiconductor package
    • Patent number 8,772,921
    • Issue date Jul 8, 2014
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Through silicon via dies and packages
    • Patent number 8,741,762
    • Issue date Jun 3, 2014
    • United Test & Assembly Center Ltd.
    • Hao Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Through silicon via dies and packages
    • Patent number 8,586,465
    • Issue date Nov 19, 2013
    • United Test & Assembly Center Ltd.
    • Hao Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Vented die and package
    • Patent number 8,426,246
    • Issue date Apr 23, 2013
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Mold design and semiconductor package
    • Patent number 8,399,985
    • Issue date Mar 19, 2013
    • United Test & Assembly Center Ltd.
    • Ravi Kanth Kolan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging structural member
    • Patent number 8,384,203
    • Issue date Feb 26, 2013
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Vented die and package
    • Patent number 8,143,719
    • Issue date Mar 27, 2012
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interposer for semiconductor package
    • Patent number 8,115,292
    • Issue date Feb 14, 2012
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Mold design and semiconductor package
    • Patent number 8,030,761
    • Issue date Oct 4, 2011
    • United Test & Assembly Center Ltd.
    • Ravi Kanth Kolan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked die semiconductor package and method of assembly
    • Patent number 7,883,938
    • Issue date Feb 8, 2011
    • United Test & Assembly Center Ltd.
    • Ravi Kanth Kolan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Structurally-enhanced integrated circuit package and method of manu...
    • Patent number 7,830,006
    • Issue date Nov 9, 2010
    • United Test and Assembly Center, Ltd.
    • Ravi Kanth Kolan
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents