Ravi Nalla

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structured light 3D sensors with variable focal length lenses and i...
- Patent number 10,652,475
- Issue date May 12, 2020
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultra-compact image sensor assembly for thin profile devices
- Patent number 10,602,039
- Issue date Mar 24, 2020
- Microsoft Technology Licensing, LLC
- Ravi Kiran Nalla
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
3D imaging recognition by stereo matching of RGB and infrared images
- Patent number 10,521,650
- Issue date Dec 31, 2019
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structured light 3D sensors with variable focal length lenses and i...
- Patent number 10,469,758
- Issue date Nov 5, 2019
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tailored illumination profile for articulated hand tracking
- Patent number 10,430,647
- Issue date Oct 1, 2019
- Microsoft Licensing Technology, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for time of flight laser pulse engineering
- Patent number 10,386,486
- Issue date Aug 20, 2019
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G01 - MEASURING TESTING
Information Patent Grant
3D imaging recognition by stereo matching of RGB and infrared images
- Patent number 10,372,974
- Issue date Aug 6, 2019
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enhanced illumination system
- Patent number 10,261,328
- Issue date Apr 16, 2019
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Grant
Laser diode chip on printed circuit board
- Patent number 10,257,932
- Issue date Apr 9, 2019
- Microsoft Technology Licensing, LLC
- David Mandelboum
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image capture device having light field image capture mode, 2D imag...
- Patent number 10,154,197
- Issue date Dec 11, 2018
- Google LLC
- Jerome Chandra Bhat
- G02 - OPTICS
Information Patent Grant
Illumination module
- Patent number 10,048,498
- Issue date Aug 14, 2018
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Grant
High thermal conductivity region for optoelectronic devices
- Patent number 10,051,723
- Issue date Aug 14, 2018
- Microsoft Technology Licensing, LLC
- Ravi Kiran Nalla
- G02 - OPTICS
Information Patent Grant
Illumination module for near eye-to-eye display system
- Patent number 10,003,726
- Issue date Jun 19, 2018
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,929,097
- Issue date Mar 27, 2018
- Intel Corporation
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical cross talk mitigation for optical device having disrupting...
- Patent number 9,851,478
- Issue date Dec 26, 2017
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 9,780,054
- Issue date Oct 3, 2017
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with large-area global shutter contact
- Patent number 9,769,398
- Issue date Sep 19, 2017
- Microsoft Technology Licensing, LLC
- Ravi Kiran Nalla
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Enhanced camera module mount
- Patent number 9,726,962
- Issue date Aug 8, 2017
- Microsoft Technology Licensing, LLC
- Ravi Nalla
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Light field image capture device having 2D image capture mode
- Patent number 9,411,122
- Issue date Aug 9, 2016
- Lytro, Inc.
- Jerome Chandra Bhat
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
- Patent number 9,406,618
- Issue date Aug 2, 2016
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming functionalized carrier structures with coreless packages
- Patent number 9,257,380
- Issue date Feb 9, 2016
- Intel Corporation
- Ravi K. Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming in-situ micro-feature structures with coreless packages
- Patent number 9,214,439
- Issue date Dec 15, 2015
- Intel Corporation
- Ravi K. Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light field image capture device having 2D image capture mode
- Patent number 9,077,901
- Issue date Jul 7, 2015
- Lytro, Inc.
- Jerome Chandra Bhat
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,040,842
- Issue date May 26, 2015
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 8,901,724
- Issue date Dec 2, 2014
- Intel Corporation
- John Stephen Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package and method of manufacturing same
- Patent number 8,896,116
- Issue date Nov 25, 2014
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer and laminated core hybrid structures and me...
- Patent number 8,809,124
- Issue date Aug 19, 2014
- Intel Corporation
- Mathew J. Manusharow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
- Patent number 8,786,066
- Issue date Jul 22, 2014
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming in-situ micro-feature structures with coreless packages
- Patent number 8,772,924
- Issue date Jul 8, 2014
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming functionalized carrier structures with coreless packages
- Patent number 8,618,652
- Issue date Dec 31, 2013
- Intel Corporation
- Ravi K Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURED LIGHT 3D SENSORS WITH VARIABLE FOCAL LENGTH LENSES AND I...
- Publication number 20200053291
- Publication date Feb 13, 2020
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D IMAGING RECOGNITION BY STEREO MATCHING OF RGB AND INFRARED IMAGES
- Publication number 20190332853
- Publication date Oct 31, 2019
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
- Publication number 20190208630
- Publication date Jul 4, 2019
- Microsoft Technology Licensing, LLC
- David MANDELBOUM
- F21 - LIGHTING
Information Patent Application
MODIFYING ILLUMINATION PROFILE FOR LIGHT SOURCE
- Publication number 20180213206
- Publication date Jul 26, 2018
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- F21 - LIGHTING
Information Patent Application
Tailored Illumination Profile for Articulated Hand Tracking
- Publication number 20180204055
- Publication date Jul 19, 2018
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D IMAGING RECOGNITION BY STEREO MATCHING OF RGB AND INFRARED IMAGES
- Publication number 20180196997
- Publication date Jul 12, 2018
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VARIABLE FOCAL LENGTH LENSES AND ILLUMINATORS ON TIME OF FLIGHT 3D...
- Publication number 20180160101
- Publication date Jun 7, 2018
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- B60 - VEHICLES IN GENERAL
Information Patent Application
US
- Publication number 20180160047
- Publication date Jun 7, 2018
- Microsoft Technology Licensing, LLC
- Raymond Kirk Price
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL CROSS TALK MITIGATION FOR LIGHT EMITTER
- Publication number 20180149776
- Publication date May 31, 2018
- Microsoft Technology Licensing, LLC
- Ravi Kiran Nalla
- G02 - OPTICS
Information Patent Application
Ultra-Compact Image Sensor Assembly for Thin Profile Devices
- Publication number 20180084647
- Publication date Mar 22, 2018
- Ravi Kiran Nalla
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ENHANCED ILLUMINATION SYSTEM
- Publication number 20180067324
- Publication date Mar 8, 2018
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Application
High Thermal Conductivity Region for Optoelectronic Devices
- Publication number 20180035531
- Publication date Feb 1, 2018
- Ravi Kiran Nalla
- G02 - OPTICS
Information Patent Application
SYSTEMS AND METHODS FOR TIME OF FLIGHT LASER PULSE ENGINEERING
- Publication number 20170363742
- Publication date Dec 21, 2017
- Raymond Kirk Price
- G01 - MEASURING TESTING
Information Patent Application
PULSED GATED STRUCTURED LIGHT SYSTEMS AND METHODS
- Publication number 20170353712
- Publication date Dec 7, 2017
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Application
Illumination Module
- Publication number 20170280031
- Publication date Sep 28, 2017
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Application
Illumination Module
- Publication number 20170276942
- Publication date Sep 28, 2017
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Application
ENHANCED LENS ASSEMBLY
- Publication number 20170276897
- Publication date Sep 28, 2017
- Ravi Nalla
- G02 - OPTICS
Information Patent Application
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
- Publication number 20170238420
- Publication date Aug 17, 2017
- David Mandelboum
- F21 - LIGHTING
Information Patent Application
OPTICAL CROSS TALK MITIGATION FOR OPTICAL DEVICE
- Publication number 20170227686
- Publication date Aug 10, 2017
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Application
EMI SHIELD FOR AN ELECTRONIC OPTICAL DEVICE
- Publication number 20170215305
- Publication date Jul 27, 2017
- Raymond Kirk Price
- G02 - OPTICS
Information Patent Application
Image Sensor with Large-Area Global Shutter Contact
- Publication number 20170195588
- Publication date Jul 6, 2017
- Ravi Kiran Nalla
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE CAPTURE DEVICE HAVING LIGHT FIELD IMAGE CAPTURE MODE, 2D IMAG...
- Publication number 20160316144
- Publication date Oct 27, 2016
- LYTRO, INC.
- Jerome Chandra Bhat
- G02 - OPTICS
Information Patent Application
HYBRID LIGHT-FIELD CAMERA
- Publication number 20160182786
- Publication date Jun 23, 2016
- LYTRO, INC.
- David Anderson
- G02 - OPTICS
Information Patent Application
MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...
- Publication number 20160079174
- Publication date Mar 17, 2016
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT FIELD IMAGE CAPTURE DEVICE HAVING 2D IMAGE CAPTURE MODE
- Publication number 20150247986
- Publication date Sep 3, 2015
- LYTRO, INC.
- Jerome Chandra Bhat
- G02 - OPTICS
Information Patent Application
FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES
- Publication number 20150179559
- Publication date Jun 25, 2015
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT FIELD IMAGE CAPTURE DEVICE HAVING 2D IMAGE CAPTURE MODE
- Publication number 20150070474
- Publication date Mar 12, 2015
- LYTRO, INC.
- Jerome Chandra Bhat
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
- Publication number 20150050781
- Publication date Feb 19, 2015
- lintel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING IN-SITU MICRO-FEATURE STRUCTURES WITH CORELESS PACKAGES
- Publication number 20140367843
- Publication date Dec 18, 2014
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
- Publication number 20140327149
- Publication date Nov 6, 2014
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Structured light 3D sensors with variable focal length lenses and i...

Ultra-compact image sensor assembly for thin profile devices

3D imaging recognition by stereo matching of RGB and infrared images

Structured light 3D sensors with variable focal length lenses and i...

Tailored illumination profile for articulated hand tracking

Systems and methods for time of flight laser pulse engineering

3D imaging recognition by stereo matching of RGB and infrared images

Enhanced illumination system

Laser diode chip on printed circuit board

Image capture device having light field image capture mode, 2D imag...

Illumination module

High thermal conductivity region for optoelectronic devices

Illumination module for near eye-to-eye display system

Mechanical adhesion of copper metallization to dielectric with part...

Optical cross talk mitigation for optical device having disrupting...

Semiconductor package with embedded die and its methods of fabrication

Image sensor with large-area global shutter contact

Enhanced camera module mount

Light field image capture device having 2D image capture mode

Die-stacking using through-silicon vias on bumpless build-up layer...

Forming functionalized carrier structures with coreless packages

Forming in-situ micro-feature structures with coreless packages

Light field image capture device having 2D image capture mode

Mechanical adhesion of copper metallization to dielectric with part...

Semiconductor package with embedded die and its methods of fabrication

Microelectronic package and method of manufacturing same

Bumpless build-up layer and laminated core hybrid structures and me...

Die-stacking using through-silicon vias on bumpless build-up layer...

Forming in-situ micro-feature structures with coreless packages

Forming functionalized carrier structures with coreless packages

Patents Applicationslast 30 patents

STRUCTURED LIGHT 3D SENSORS WITH VARIABLE FOCAL LENGTH LENSES AND I...

3D IMAGING RECOGNITION BY STEREO MATCHING OF RGB AND INFRARED IMAGES

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

MODIFYING ILLUMINATION PROFILE FOR LIGHT SOURCE

Tailored Illumination Profile for Articulated Hand Tracking

3D IMAGING RECOGNITION BY STEREO MATCHING OF RGB AND INFRARED IMAGES

VARIABLE FOCAL LENGTH LENSES AND ILLUMINATORS ON TIME OF FLIGHT 3D...

US

OPTICAL CROSS TALK MITIGATION FOR LIGHT EMITTER

Ultra-Compact Image Sensor Assembly for Thin Profile Devices

ENHANCED ILLUMINATION SYSTEM

High Thermal Conductivity Region for Optoelectronic Devices

SYSTEMS AND METHODS FOR TIME OF FLIGHT LASER PULSE ENGINEERING

PULSED GATED STRUCTURED LIGHT SYSTEMS AND METHODS

Illumination Module

Illumination Module

ENHANCED LENS ASSEMBLY

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

OPTICAL CROSS TALK MITIGATION FOR OPTICAL DEVICE

EMI SHIELD FOR AN ELECTRONIC OPTICAL DEVICE

Image Sensor with Large-Area Global Shutter Contact

IMAGE CAPTURE DEVICE HAVING LIGHT FIELD IMAGE CAPTURE MODE, 2D IMAG...

HYBRID LIGHT-FIELD CAMERA

MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...

LIGHT FIELD IMAGE CAPTURE DEVICE HAVING 2D IMAGE CAPTURE MODE

FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES

LIGHT FIELD IMAGE CAPTURE DEVICE HAVING 2D IMAGE CAPTURE MODE

SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION

FORMING IN-SITU MICRO-FEATURE STRUCTURES WITH CORELESS PACKAGES

DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...