Ravindranadh ELURI

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with embedded interconnects
- Patent number 11,942,406
- Issue date Mar 26, 2024
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
- Patent number 11,488,918
- Issue date Nov 1, 2022
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded interconnects
- Patent number 11,393,745
- Issue date Jul 19, 2022
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- Publication number 20240177907
- Publication date May 30, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
- Publication number 20240123561
- Publication date Apr 18, 2024
- Intel Corporation
- Yosef KORNBLUTH
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20230015619
- Publication date Jan 19, 2023
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS
- Publication number 20220302005
- Publication date Sep 22, 2022
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING USING FLUORESCENCE-BASED ENDPOINT DET...
- Publication number 20210260718
- Publication date Aug 26, 2021
- Intel Corporation
- Srini Raghavan
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS
- Publication number 20210082797
- Publication date Mar 18, 2021
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20200135679
- Publication date Apr 30, 2020
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS

Ravindranadh ELURI

Person

Patents Grantslast 30 patents

Semiconductor packages with embedded interconnects

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Surface finishes with low rBTV for fine and mixed bump pitch archit...

Semiconductor packages with embedded interconnects

Patents Applicationslast 30 patents

CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF

MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS

CHEMICAL MECHANICAL POLISHING USING FLUORESCENCE-BASED ENDPOINT DET...

SEMICONDUCTOR PACKAGES WITH EMBEDDED INTERCONNECTS

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...