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Ray Chen
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Fremont, CA, US
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last 30 patents
Information
Patent Grant
Integrated circuit/substrate interconnect system and method of manu...
Patent number
8,198,727
Issue date
Jun 12, 2012
NVIDIA Corporation
Inderjit Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method of manufacture for interconnecting an integrated...
Patent number
7,838,999
Issue date
Nov 23, 2010
NVIDIA Corporation
Inderjit Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having bypass capacitors coupled to bott...
Patent number
6,894,385
Issue date
May 17, 2005
NVIDIA Corporation
Behdad Jafari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making metal core substrate printed circuit wiring board...
Patent number
6,711,812
Issue date
Mar 30, 2004
Unicap Electronics Industrial Corporation
Jane Lu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Metal core substrate printed wiring board enabling thermally enhanc...
Publication number
20040163248
Publication date
Aug 26, 2004
Unicap Electronics Industrial Corporation
Jane Lu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR