Claims
- 1. A method of making a thermally enhanced printed circuit wiring board substrate for ball grid integrated circuit packages comprising the steps of:
a) providing an initial thin conductive metal core having oppositely facing surfaces, b) forming one or more holes in said metal core at each of a plurality of through-core via sites, c) laminating a thin rigidifying non-conductive dielectric sheet to each said oppositely facing surfaces, respectively, and d) applying at least one thin conductive layer on a surface of one of said thin rigidifying non-conductive sheets and making at least one electrical connection to said initial thin conductive metal core at one of said plurality of through-core via sites.
- 2. The method defined in claim 1 including the step of making one or more of Type 1 vias as defined herein at one or more via sites.
- 3. The method defined in claim 1 including the step of forming one or more Type 2 vias as defined herein at one or more via.
- 4. The method defined in claim 1 including the step of forming one or more Type 3 vias as defined herein at one or more via.
- 5. The method defined in claim 2 including the step of forming one or more Type 2 or Type 3 via at one or more via sites.
- 6. The method defined in claim 4 wherein said Type 3 via is isolated from the core and connected to the outer layer to build up vias.
- 7. The method defined in claim 3 wherein said vias are made by through-hole plating directly to the core layer and followed by plating resulting in sidewall connection with the core.
- 8. A method defined in claim 1 wherein said plurality of through-core via sites are drilled, plated through-holes (PTH).
- 9. The method defined in claim 1 wherein said vias are made by printing build-up and connection to the core in both top and bottom sides thereof.
- 10. The method defined in claim 1 including the step of forming singulation lines at the border of said substrate which can be predrilled or pre-etched during the first via drill step for each singulation in strip or singulated to delivery format.
- 11. A thermally enhanced printed circuit (PC) wiring board for ball grid integrated circuit packages comprising a relatively thin, conductive metal core layer having oppositely facing surfaces and one or more holes in the metal core at each of a plurality of through-core via sites,
a first and second thin rigidifying non-conductive laminate sheet attached to said oppositely facing surfaces, respectively, and at least one conductive circuit pattern on at least one of said thin rigidifying non-conductive sheets and a plurality of vias thereon.
- 12. The PC wiring board defined in claim 11 including a plurality of vias made by plating build-up and connecting to the core from both the top and bottom sides thereof.
- 13. The PC wiring board defined in claim 11 wherein said conductive metal core layer is copper in the range of 5-15 mils think and said laminate sheets are fiberglass.
- 14. The PC wiring board defined in claim 13 including one or more additional non-conductive and conductive layers thereon.
- 15. The PC wiring board defined in claim 11 including a plurality of vias selected from Type 1, Type 2 or Type 3 vias as defined herein.
- 16. The PC wiring board defined in claim 12 including a plurality of vias selected from Type 1, Type 2 or Type 3 vias as defined herein.
REFERENCE TO RELATED APPLICATION
[0001] The present application is based on provisional application Serial No. 60/128,948 filed Apr. 13, 1999 entitled METAL CORE SUBSTRATE ENABLING THERMALLY ENHANCED BALL GRID ARRAY PACKAGES.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60128948 |
Apr 1999 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
09544263 |
Apr 2000 |
US |
Child |
10784813 |
Feb 2004 |
US |