Raymond M. Roop

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sensing field effect transistor devices, systems in which they are...
- Patent number 10,107,779
- Issue date Oct 23, 2018
- NXP USA, INC.
- Raymond M. Roop
- G01 - MEASURING TESTING
Information Patent Grant
Sensing field effect transistor devices, systems in which they are...
- Patent number 9,927,392
- Issue date Mar 27, 2018
- NXP USA, INC.
- Raymond M. Roop
- G01 - MEASURING TESTING
Information Patent Grant
Protected sensor field effect transistors
- Patent number 9,857,329
- Issue date Jan 2, 2018
- NXP USA, INC.
- Patrice M. Parris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protected sensor field effect transistors
- Patent number 9,494,550
- Issue date Nov 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Patrice M. Parris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing field effect transistor devices and method of their manufac...
- Patent number 9,470,652
- Issue date Oct 18, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Sensor packaging method and sensor packages
- Patent number 9,165,886
- Issue date Oct 20, 2015
- Freescale Semiconductor,INC
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of forming same
- Patent number 9,040,355
- Issue date May 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vent hole sealing in multiple die sensor device
- Patent number 9,018,029
- Issue date Apr 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor packaging method and sensor packages
- Patent number 8,659,167
- Issue date Feb 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a seal for a semiconductor device
- Patent number 7,585,744
- Issue date Sep 8, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Bishnu P. Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming a semiconductor structure through epitaxial growth
- Patent number 6,916,728
- Issue date Jul 12, 2005
- Freescale Semiconductor, Inc.
- Bishnu Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature plasma Si or SiGe for MEMS applications
- Patent number 6,770,569
- Issue date Aug 3, 2004
- Freescale Semiconductor, Inc.
- Juergen A. Foerstner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component
- Patent number 6,720,635
- Issue date Apr 13, 2004
- Motorola, Inc.
- Daniel J. Koch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a movable gate
- Patent number 5,818,093
- Issue date Oct 6, 1998
- Motorola, Inc.
- Ronald J. Gutteridge
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit for sensing an environmental condition and produ...
- Patent number 5,493,248
- Issue date Feb 20, 1996
- Motorola, Inc.
- William C. Dunn
- G01 - MEASURING TESTING
Information Patent Grant
Vibration monolithic gyroscope
- Patent number 5,329,815
- Issue date Jul 19, 1994
- Motorola, Inc.
- William C. Dunn
- G01 - MEASURING TESTING
Information Patent Grant
Microprocessor having environmental sensing capability
- Patent number 5,291,607
- Issue date Mar 1, 1994
- Motorola, Inc.
- Ljubisa Ristic
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Monolithic circuit with integrated bulk structure resonator
- Patent number 5,260,596
- Issue date Nov 9, 1993
- Motorola, Inc.
- William C. Dunn
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Low voltage, deep junction device and method
- Patent number 5,141,887
- Issue date Aug 25, 1992
- Motorola, Inc.
- Hang M. Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with improved turn-off characteristics
- Patent number 4,047,218
- Issue date Sep 6, 1977
- Motorola, Inc.
- Lowell E. Clark
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSING FIELD EFFECT TRANSISTOR DEVICES, SYSTEMS IN WHICH THEY ARE...
- Publication number 20180188203
- Publication date Jul 5, 2018
- NXP USA, Inc.
- Raymond M. ROOP
- G01 - MEASURING TESTING
Information Patent Application
PROTECTED SENSOR FIELD EFFECT TRANSISTORS
- Publication number 20160370314
- Publication date Dec 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Patrice M. Parris
- G01 - MEASURING TESTING
Information Patent Application
PROTECTED SENSOR FIELD EFFECT TRANSISTORS
- Publication number 20160356740
- Publication date Dec 8, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Patrice M. Parris
- G01 - MEASURING TESTING
Information Patent Application
SENSING FIELD EFFECT TRANSISTOR DEVICES, SYSTEMS IN WHICH THEY ARE...
- Publication number 20160047775
- Publication date Feb 18, 2016
- RAYMOND M. ROOP
- G01 - MEASURING TESTING
Information Patent Application
SENSOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20150048462
- Publication date Feb 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGES
- Publication number 20140124958
- Publication date May 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGES
- Publication number 20140061948
- Publication date Mar 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20140015123
- Publication date Jan 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming a seal for a semiconductor device
- Publication number 20050124089
- Publication date Jun 9, 2005
- Bishnu P. Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor structure and method of manufacture
- Publication number 20040119125
- Publication date Jun 24, 2004
- MOTOROLA INC.
- Bishnu Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Low temperature plasma Si or SiGe for MEMS applications
- Publication number 20040023429
- Publication date Feb 5, 2004
- MOTOROLA INC.
- Juergen A. Foerstner
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Raymond M. Roop

Person

Patents Grantslast 30 patents

Sensing field effect transistor devices, systems in which they are...

Sensing field effect transistor devices, systems in which they are...

Protected sensor field effect transistors

Protected sensor field effect transistors

Sensing field effect transistor devices and method of their manufac...

Sensor packaging method and sensor packages

Sensor package and method of forming same

Vent hole sealing in multiple die sensor device

Sensor packaging method and sensor packages

Method of forming a seal for a semiconductor device

Method for forming a semiconductor structure through epitaxial growth

Low temperature plasma Si or SiGe for MEMS applications

Electronic component

Semiconductor device having a movable gate

Integrated circuit for sensing an environmental condition and produ...

Vibration monolithic gyroscope

Microprocessor having environmental sensing capability

Monolithic circuit with integrated bulk structure resonator

Low voltage, deep junction device and method

Semiconductor devices with improved turn-off characteristics

Patents Applicationslast 30 patents

SENSING FIELD EFFECT TRANSISTOR DEVICES, SYSTEMS IN WHICH THEY ARE...

PROTECTED SENSOR FIELD EFFECT TRANSISTORS

PROTECTED SENSOR FIELD EFFECT TRANSISTORS

SENSING FIELD EFFECT TRANSISTOR DEVICES, SYSTEMS IN WHICH THEY ARE...

SENSOR PACKAGE AND METHOD OF FORMING SAME

SENSOR PACKAGING METHOD AND SENSOR PACKAGES

SENSOR PACKAGING METHOD AND SENSOR PACKAGES

SENSOR PACKAGE AND METHOD OF FORMING SAME

Method of forming a seal for a semiconductor device

Semiconductor structure and method of manufacture

Low temperature plasma Si or SiGe for MEMS applications