Raymond T. Galasco

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a printed wiring board with conformally plated cir...
- Patent number 7,378,227
- Issue date May 27, 2008
- International Business Machines Corporation
- Edmond Otto Fey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with filled blinds vias
- Patent number 7,084,509
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plated invar with acid preclean
- Patent number 6,935,018
- Issue date Aug 30, 2005
- International Business Machines Corporation
- Raymond T. Galasco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming filled blind vias
- Patent number 6,924,224
- Issue date Aug 2, 2005
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Colloidal seed formulation for printed circuit board metallization
- Patent number 6,852,152
- Issue date Feb 8, 2005
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board with conformally plated circuit traces
- Patent number 6,815,126
- Issue date Nov 9, 2004
- International Business Machines Corporation
- Edmond Otto Fey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement and method for degassing small-high aspect ratio drille...
- Patent number 6,626,196
- Issue date Sep 30, 2003
- International Busines Machines Corporation
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin film attachment to laminate using a dendritic interconnection
- Patent number 6,600,224
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,576,549
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,522,014
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plated invar with acid preclean
- Patent number 6,518,509
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Raymond T. Galasco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removal of metal skin from a copper-Invar-copper laminate
- Patent number 6,228,246
- Issue date May 8, 2001
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biased acid cleaning of a copper-invar-copper laminate
- Patent number 6,179,990
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Raymond Thomas Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminated electroplating rack and connection system for optimized p...
- Patent number 6,176,985
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Francis J. Downes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for uniform plating of dendrites
- Patent number 6,043,150
- Issue date Mar 28, 2000
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform plating of dendrites
- Patent number 5,939,786
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming electrical connection to the inner layers of a m...
- Patent number 5,472,735
- Issue date Dec 5, 1995
- International Business Machines Corporation
- Christina M. Boyko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of solder bonding processor package
- Patent number 5,432,998
- Issue date Jul 18, 1995
- International Business Machines, Corporation
- Raymond T. Galasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective electroetch of copper and other metals
- Patent number 5,374,338
- Issue date Dec 20, 1994
- International Business Machines Corporation
- Christina M. Boyko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper plating bath having increased plating rate, and method
- Patent number 4,540,473
- Issue date Sep 10, 1985
- International Business Machines Corporation
- Perminder S. Bindra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for determination of concentration of organic additive in pl...
- Patent number 4,479,852
- Issue date Oct 30, 1984
- International Business Machines Corporation
- Perminder S. Bindra
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method of making a printed wiring board with conformally plated cir...
- Publication number 20050058945
- Publication date Mar 17, 2005
- International Business Machines Corporation
- Edmond Otto Fey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Colloidal seed formation for printed circuit board metallization
- Publication number 20050042383
- Publication date Feb 24, 2005
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic package with filled blind vias
- Publication number 20040132279
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package with filled blinds vias
- Publication number 20040065960
- Publication date Apr 8, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Colloidal seed formation for printed circuit board metallization
- Publication number 20040058071
- Publication date Mar 25, 2004
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Printed wiring board with conformally plated circuit traces
- Publication number 20030188886
- Publication date Oct 9, 2003
- International Business Machines Corporation
- Edmond Otto Fey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper plated invar with acid preclean
- Publication number 20030102224
- Publication date Jun 5, 2003
- Raymond T. Galasco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication of a metalized blind via
- Publication number 20030054635
- Publication date Mar 20, 2003
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement and method for degassing small-high aspect ratio drille...
- Publication number 20020189637
- Publication date Dec 19, 2002
- International Business Machines
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Raymond T. Galasco

Person

Patents Grantslast 30 patents

Method of making a printed wiring board with conformally plated cir...

Electronic package with filled blinds vias

Copper plated invar with acid preclean

Method of forming filled blind vias

Colloidal seed formulation for printed circuit board metallization

Printed wiring board with conformally plated circuit traces

Arrangement and method for degassing small-high aspect ratio drille...

Thin film attachment to laminate using a dendritic interconnection

Fabrication of a metalized blind via

Fabrication of a metalized blind via

Copper plated invar with acid preclean

Removal of metal skin from a copper-Invar-copper laminate

Biased acid cleaning of a copper-invar-copper laminate

Laminated electroplating rack and connection system for optimized p...

Method for uniform plating of dendrites

Uniform plating of dendrites

Method for forming electrical connection to the inner layers of a m...

Method of solder bonding processor package

Selective electroetch of copper and other metals

Copper plating bath having increased plating rate, and method

Method for determination of concentration of organic additive in pl...

Patents Applicationslast 30 patents

Method of making a printed wiring board with conformally plated cir...

Colloidal seed formation for printed circuit board metallization

Electronic package with filled blind vias

Electronic package with filled blinds vias

Colloidal seed formation for printed circuit board metallization

Printed wiring board with conformally plated circuit traces

Copper plated invar with acid preclean

Fabrication of a metalized blind via

Arrangement and method for degassing small-high aspect ratio drille...