Renren He

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
ECP gap fill by modulating the voltate on the seed layer to increas...
- Patent number 6,746,591
- Issue date Jun 8, 2004
- Applied Materials Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING O...
- Publication number 20090120799
- Publication date May 14, 2009
- Zhi-Wen Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of direct plating of copper on a substrate structure
- Publication number 20070125657
- Publication date Jun 7, 2007
- Zhi-Wen Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating chemistry and method of single-step electroplating of coppe...
- Publication number 20050274622
- Publication date Dec 15, 2005
- Zhi-Wen Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of barrier layer surface treatment to enable direct copper p...
- Publication number 20050274621
- Publication date Dec 15, 2005
- Zhi-Wen Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multiple-step electrodeposition process for direct copper plating o...
- Publication number 20050006245
- Publication date Jan 13, 2005
- APPLIED MATERIALS, INC.
- Zhi-Wen Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ECP GAP FILL BY MODULATING THE VOLTAGE ON THE SEED LAYER TO INCREAS...
- Publication number 20040045831
- Publication date Mar 11, 2004
- APPLIED MATERIALS, INC.
- Bo Zheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

ECP gap fill by modulating the voltate on the seed layer to increas...

Patents Applicationslast 30 patents

MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING O...

Method of direct plating of copper on a substrate structure

Plating chemistry and method of single-step electroplating of coppe...

Method of barrier layer surface treatment to enable direct copper p...

Multiple-step electrodeposition process for direct copper plating o...

ECP GAP FILL BY MODULATING THE VOLTAGE ON THE SEED LAYER TO INCREAS...