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Reynaldo A. Olmedo
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Phoenix, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Magnetic small footprint inductor array module for on-package volta...
Patent number
10,741,536
Issue date
Aug 11, 2020
Intel Corporation
Yongki Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic small footprint inductor array module for on-package volta...
Patent number
10,340,260
Issue date
Jul 2, 2019
Intel Corporation
Yongki Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an EMI shielding layer
Patent number
9,991,211
Issue date
Jun 5, 2018
Intel Corporation
Anna M. Prakash
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic small footprint inductor array module for on-package volta...
Patent number
9,911,723
Issue date
Mar 6, 2018
Intel Corporation
Yongki Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an EMI shielding layer
Patent number
9,685,413
Issue date
Jun 20, 2017
Intel Corporation
Anna M. Prakash
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple surface finishes for microelectronic package substrates
Patent number
8,461,036
Issue date
Jun 11, 2013
Intel Corporation
Tao Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...
Publication number
20190279973
Publication date
Sep 12, 2019
Intel Corporation
Yongki Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...
Publication number
20180197845
Publication date
Jul 12, 2018
Intel Corporation
Yongki Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER
Publication number
20170287851
Publication date
Oct 5, 2017
Intel Corporation
Anna M. Prakash
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...
Publication number
20170179094
Publication date
Jun 22, 2017
Yongki Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE SURFACE FINISHES FOR MICROELECTRONIC PACKAGE SUBSTRATES
Publication number
20110147933
Publication date
Jun 23, 2011
Tao Wu
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Coreless substrate package with symmetric external dielectric layers
Publication number
20090321932
Publication date
Dec 31, 2009
Javier Soto Gonzalez
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR